H10P 72/1918
Characterised by coupling elements, kinematic members, handles or elements to be externally
Official title: {characterised by coupling elements, kinematic members, handles or elements to be externally gripped}
H10P72/1918 (Characterised by coupling elements, kinematic members, handles or elements to be externally) appears on 356 US grants and 407 published applications in this corpus.
Search patents in H10P- Granted patents
- 356
- Published applications
- 407
- Assignees
- 126
- Inventors
- 636
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 6 | 0 |
| 2001 | 7 | 3 |
| 2002 | 16 | 14 |
| 2003 | 5 | 14 |
| 2004 | 9 | 11 |
| 2005 | 5 | 13 |
| 2006 | 9 | 17 |
| 2007 | 7 | 13 |
| 2008 | 11 | 16 |
| 2009 | 8 | 16 |
| 2010 | 10 | 12 |
| 2011 | 10 | 9 |
| 2012 | 10 | 9 |
| 2013 | 7 | 10 |
| 2014 | 11 | 8 |
| 2015 | 8 | 19 |
| 2016 | 10 | 21 |
| 2017 | 14 | 16 |
| 2018 | 23 | 18 |
| 2019 | 19 | 24 |
| 2020 | 19 | 31 |
| 2021 | 25 | 30 |
| 2022 | 19 | 16 |
| 2023 | 21 | 32 |
| 2024 | 25 | 11 |
| 2025 | 18 | 12 |
| 2026 | 10 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Compound fork device and system including the same11 Aug 2026US 12,703,107 B2Taiwan Semiconductor Manufacturing Company.Ltd
- System for storing wafer and system for monitoring pollution of wafer4 Aug 2026US 12,701,954 B2Foxsemicon Integrated Technology, Inc.
- Device and method for handling pot-shaped hollow bodies, more particularly transport containers for semiconductor wafers or EUV lithography masks21 Jul 2026US 12,690,415 B2Gsec German Semiconductor Equipment Company GmbH
- Purge nozzle assembly and semiconductor processing assembly including the purge nozzle assembly23 Jun 2026US 12,666,908 B2ASM IP Holding B. V.
- Wafer container, top cover thereof, and method for managing wafer containers8 Oct 2026US 2026/0314313 A1Nanya Technology Corporation
- Film tray semiconductor chip carrier17 Sep 2026US 2026/0282817 A1Arm Limited
- Apparatus and method for cleaning pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for lithography masks23 Jul 2026US 2026/0208241 A1Gsec German Semiconductor Equipment Company GmbH
- Cleaning apparatus, treatment apparatus and method for respectively cleaning and treating pot-shaped hollow bodies, in particular transporting containers for semiconductor wafers or for lithography masks2 Jul 2026US 2026/0183809 A1Gsec German Semiconductor Equipment Company GmbH
- Cassette hold down with contact arms2 Jul 2026US 2026/0190928 A1Entegris, Inc.
Most cited
By later US patents
- Method and apparatus for batch processing of wafers in a furnace511US 6,835,039 B2ASM International N.V. · 2004
- Substrate storage cassette positioning device and method487US 6,432,849 B1Nikon Corporation · 2002
- Wafer handling system486US 6,981,832 B2ASM International N.V. · 2006
- System for separately handling different size FOUPs470US 9,142,437 B2Globalfoundries Inc. · 2015
- Wafer processing apparatus, method of operating the same and wafer detecting system447US 6,390,754 B1Tokyo Electron Limited · 2002