Purge nozzle assembly and semiconductor processing assembly including the purge nozzle assembly

A purge nozzle assembly comprising:

• a purge nozzle body including an inlet opening and an outlet opening wherein the outlet opening opens into a purge nozzle contact surface;
• a mounting body for connecting the purge nozzle assembly to an external frame member;
• a mechanical coupling mechanism moveably coupling the purge nozzle body with the mounting body and configured to:
• allow tilting of the purge nozzle body relative to the mounting body;
• and
• to allow a lateral movement of the purge nozzle body relative to the mounting body, wherein the lateral movement has a movement component which is substantially parallel to the contact surface,
• wherein the mechanical coupling mechanism comprises:
• at least one spring connected to the purge nozzle body and the mounting body and configured to bias the purge nozzle body relative to the mounting body in a direction substantially perpendicular to the purge nozzle contact surface and directed away from the purge nozzle contact surface, and
• a number of pull elements connected with the purge nozzle body and the mounting body, which pull elements are pulled taut by the at least one spring to provide a defined initial position of the purge nozzle body relative to the mounting body.