Wafer container, top cover thereof, and method for managing wafer containers
AssigneeNanya Technology Corporation
InventorsChi Ming Pan, Pohsien Chen, Zheng-Xun Yang
Life of this patent
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Abstract
A method for managing a plurality of wafer containers in a facility includes: using an overhead hoist transport system to transport the wafer containers, the overhead hoist transport system includes a vehicle, the vehicle includes a grip device, each of the wafer containers includes a top flange, and the grip device is configured to grip the top flange; categorizing each of the wafer containers into a safe-to-use group or an unsafe-to-use group; and covering the top flange of each wafer container in the unsafe-to-use group with a top cover, wherein the top cover is sized or shaped to prevent the top flange from being gripped by the grip device.
Claims7
A wafer container, comprising:
- a container main body configured to accommodate one or more semiconductor wafers;
- a top flange projecting from an upper surface of the container main body, wherein the top flange comprises a neck portion and a head portion, the neck portion is connected between the container main body and the head portion, the head portion is wider than the neck portion;
- and
- a top cover for interrupting transport of the wafer container, the top cover being provided atop the top flange, wherein the head portion of the top flange has a first height and a first width, the top cover has a second height and a second width, the second height is greater than the first height, and the second width is greater than the first width, wherein the top cover is positioned entirely above the container main body,
- wherein the top cover comprises an upper wall and a sidewall, the upper wall faces an upper surface of the head portion of the top flange, the sidewall is connected to the upper wall and is arranged around the head portion,
- wherein a periphery of the head portion is formed with at least one notch, and the sidewall comprises at least one first protrusion mating with the at least one notch,
- wherein the head portion has a cavity, the upper wall comprises a second protrusion inserted in the cavity, the cavity is substantially at a center of the head portion, and the second protrusion is substantially at a center of the upper wall.
A wafer container, comprising:
- a container main body configured to accommodate one or more semiconductor wafers;
- a top flange projecting from an upper surface of the container main body, wherein the top flange comprises a neck portion and a head portion, the neck portion is connected between the container main body and the head portion, the head portion is wider than the neck portion;
- and
- a top cover for interrupting transport of the wafer container, the top cover being provided atop the top flange, wherein the head portion of the top flange has a first height and a first width, the top cover has a second height and a second width, the second height is greater than the first height, and the second width is greater than the first width, wherein the top cover is positioned entirely above the container main body,
- wherein the top cover comprises an upper wall and a sidewall, the upper wall faces an upper surface of the head portion of the top flange, the sidewall is connected to the upper wall and is arranged around the head portion,
- wherein a periphery of the head portion is formed with a notch, and the sidewall comprises a first protrusion mating with the notch, wherein the first protrusion extends in a height direction of the sidewall, and the notch extends from the upper surface of the head portion to a lower surface of the head portion.
Dependencies are inferred from the claim text.