H10P 72/0442
Apparatus for placing on an insulating substrate
Official title: {Apparatus for placing on an insulating substrate, e.g. tape}
H10P72/0442 (Apparatus for placing on an insulating substrate) appears on 1,455 US grants and 1,845 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,455
- Published applications
- 1,845
- Assignees
- 472
- Inventors
- 2,924
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 5 | 0 |
| 1990 | 6 | 0 |
| 1991 | 6 | 0 |
| 1992 | 9 | 0 |
| 1993 | 9 | 0 |
| 1994 | 5 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 9 | 0 |
| 1999 | 11 | 0 |
| 2000 | 14 | 0 |
| 2001 | 20 | 14 |
| 2002 | 23 | 31 |
| 2003 | 30 | 61 |
| 2004 | 31 | 59 |
| 2005 | 40 | 82 |
| 2006 | 40 | 70 |
| 2007 | 38 | 96 |
| 2008 | 38 | 94 |
| 2009 | 49 | 78 |
| 2010 | 66 | 88 |
| 2011 | 68 | 67 |
| 2012 | 54 | 69 |
| 2013 | 46 | 57 |
| 2014 | 48 | 51 |
| 2015 | 49 | 48 |
| 2016 | 55 | 47 |
| 2017 | 39 | 62 |
| 2018 | 43 | 72 |
| 2019 | 73 | 92 |
| 2020 | 77 | 112 |
| 2021 | 90 | 90 |
| 2022 | 77 | 96 |
| 2023 | 54 | 112 |
| 2024 | 64 | 82 |
| 2025 | 100 | 77 |
| 2026 | 44 | 38 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method of forming a die structure including a controlled thickness layer and an apparatus for performing the method15 Sep 2026US 12,740,479 B2Canon Kabushiki Kaisha
- Micro semiconductor chip transfer method and micro semiconductor chip transfer device8 Sep 2026US 12,733,294 B2Samsung Electronics Co., Ltd.
- Pick-and-place apparatus and method25 Aug 2026US 12,721,096 B2Nexperia B. V.
- Transfer stamp and method for manufacturing a transfer stamp8 Oct 2026US 2026/0314300 A1
- Manufacturing method of the semiconductor package8 Oct 2026US 2026/0314301 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Device and method for manufacturing display panel, and method of manufacturing electronic device including display panel1 Oct 2026US 2026/0305228 A1Samsung Display Co., Ltd.
- Mounting head and mounting apparatus having the mounting head1 Oct 2026US 2026/0305436 A1Shibaura Mechatronics Corporation
- Semiconductor mounting apparatus and semiconductor mounting method17 Sep 2026US 2026/0282809 A1Kioxia Corporation
Most cited
By later US patents
- Display device and method of fabricating involving peeling circuits from one substrate and mounting on other388US 5,757,456 ASemiconductor Energy Laboratory Co.Ltd. · 1998
- Using a temporary substrate to attach components to a display substrate when fabricating a passive type display device263US 6,118,502 ASemiconductor Energy Laboratory Co.Ltd. · 2000
- Method of reducing residual contamination in singulated semiconductor die237US 10,026,605 B2Semiconductor Components Industries, LLC · 2018
- Die processing235US 10,269,756 B2Invensas Bonding Technologies, Inc. · 2019
- Systems and methods for efficient transfer of semiconductor elements171US 10,446,532 B2Invensas Bonding Technologies, Inc. · 2019