Method of forming a die structure including a controlled thickness layer and an apparatus for performing the method

An apparatus, comprising:

• a first die substrate chuck for holding a first die substrate including a plurality of first dies, wherein the first die substrate has a first nonuniform thickness, a device side, and a back side opposite the device side;
• a second die substrate chuck for holding a second die substrate including a plurality of second dies, wherein the second die substrate has a second nonuniform thickness, a device side, and a back side opposite the device side;
• a dispense module configured to supply a first thickness layer onto the back side of the first die substrate and a second thickness layer onto the back side of the second die substrate;
• a singulation tool configured to singulate:
• the first die substrate and the first thickness layer into singulated first die structures that include first portions of the first thickness layer, and
• the second die substrate and the second thickness layer into singulated second die structures that include second dies and second portions of the second thickness layer;
• a transfer substrate chuck for holding a transfer substrate;
• and
• a die transfer tool configured to transfer:
• a first set of the singulated first die structures from the first die substrate chuck to the transfer substrate;
• and
• a second set of the singulated second die structures from the second die substrate chuck to the transfer substrate.

A method, comprising:

• applying a first thickness layer over a first die substrate that includes a plurality of first dies, wherein the plurality of first dies has a nonuniform thickness, and applying the first thickness layer is performed using an apparatus comprising:
• a first die substrate chuck for holding the first die substrate including the plurality of first dies, wherein the first die substrate is a first thinned substrate having a first nonuniform thickness, a device side, and a back side opposite the device side;
• a second die substrate chuck for holding a second die substrate including a plurality of second dies, wherein the second die substrate is a second thinned substrate having a second nonuniform thickness, a device side, and a back side opposite the device side, and the first die substrate has a different average thickness as compared to the second die substrate;
• a dispense module configured to supply:
• the first thickness layer onto the back side of the first die substrate to compensate for the first nonuniform thickness of the first die substrate, and
• a second thickness layer onto the back side of the second die substrate to compensate for the second nonuniform thickness of the second die substrate;
• a transfer substrate chuck for holding a transfer substrate;
• and
• a die transfer tool configured to transfer a first set of singulated first die structures and a second set of singulated second die structures to the transfer substrate, wherein each singulated first die structure includes a first die of the plurality of first dies and a first portion of the first thickness layer, and each singulated second die structure includes a second die of the plurality of second dies and a second portion of the second thickness layer;
• singulating the first die substrate and the first thickness layer to form the singulated first die structures;
• singulating the second die substrate and the second thickness layer to form the singulated second die structures;
• attaching a particular first die structure of the singulated first die structures to the transfer substrate, wherein the particular first die structure includes a particular first die;
• and
• the transfer substrate includes a particular second die structure of the singulated second die structures, wherein the particular second die structure includes a particular second die, and
• the particular second die has an average thickness different as compared to the particular first die;
• and
• bonding the particular first die structure and the particular second die structure to a particular third die,
• wherein:
• each of the particular first die structure and the particular second die structure has a proximal surface and a distal surface opposite the proximal surface, wherein the proximal surface is disposed between the particular third die and the distal surface,
• after bonding, the distal surface of the particular first die structure and the distal surface of the particular second die structure are within a tolerance of being coplanar.