Display device and method of fabricating involving peeling circuits from one substrate and mounting on other

A display device comprising:

• a first substrate;
• a transparent conductive film formed on said first substrate and forming a plurality of first conducting lines extending in a first direction;
• a first semiconductor integrated circuit connected with said first conducting lines and having TFTs, said first semiconductor integrated circuit extending in a second direction substantially perpendicular to said first direction;
• a second substrate;
• another transparent conductive film formed on said second substrate and forming a plurality of second conducting lines extending in said second direction;
• a second semiconductor integrated circuit connected with said second conducting lines and having TFTs, said second semiconductor integrated circuit extending in said first direction;
• said first and second substrates being so arranged that said first and second conducting lines are opposite to each other;
• and
• said first and second semiconductor integrated circuits peeled from other substrate carrying said first and second semiconductor integrated circuits being mounted on said first and second substrates, respectively.

A display device comprising:

• a first substrate;
• a plurality of first conducting lines formed on said first substrate and extending in a first direction;
• a first semiconductor integrated circuit connected with said first conducting lines and having TFTs, said first semiconductor integrated circuit extending in a second direction substantially perpendicular to said first direction;
• a plurality of second conducting lines formed on said first substrate and extending in said second direction;
• a second semiconductor integrated circuit connected with said second conducting lines and having TFTs, said second semiconductor integrated circuit extending in said first direction;
• a second substrate having a transparent conductive film on its surface;
• said first and second substrates being so arranged that said first and second conducting lines on said first substrate are opposite to said transparent conductive film on said second substrate;
• and
• said first and second semiconductor integrated circuits peeled from other substrate carrying said first and second semiconductor integrated circuits being mounted on said first substrate.

A method of fabricating a display device having a first substrate, a transparent conductive film formed on said first substrate and forming a plurality of first conducting lines extending in a first direction, a first semiconductor integrated circuit connected with said first conducting lines and having TFTs and extending in a second direction substantially perpendicular to said first direction, a second substrate, a second transparent conductive film formed on said second substrate and forming a plurality of second conducting lines extending in said second direction, a second semiconductor integrated circuit connected with said second conducting lines and having TFTs, said second semiconductor integrated circuit extending in said first direction, said first and second substrates being so arranged that said first conducting lines are located opposite to said second conducting lines, said method comprising the steps of:

• forming said first and second semiconductor integrated circuits on their respective support substrates via their respective peeling layers;
• bonding said first and second semiconductor integrated circuits to said first and second substrates, respectively, thus forming a laminate;
• and
• processing said laminate with a gas containing a halogen to remove said peeling layers, whereby said first and second semiconductor integrated circuits are peeled from their respective support substrates.

A method of fabricating a display device having a first substrate, a plurality of first conducting lines formed on said first substrate and extending in a first direction, a first semiconductor integrated circuit connected with said first conducting lines and having TFTs and extending in a second direction substantially perpendicular to said first direction, a plurality of second conducting lines formed on said first substrate and extending in said second direction a second semiconductor integrated circuit connected with said second conducting lines and having TFTs and extending in said first direction, a second substrate having a transparent conductive film on its surface, said first and second substrates being so arranged that said first and second conducting lines on said first substrate are located opposite to said transparent conductive film on said second substrate, said method comprising the steps of:

• forming said first and second semiconductor integrated circuits on their respective support substrates via their respective peeling layers;
• bonding said first and second semiconductor integrated circuits to said first substrate, thus forming a laminate;
• and
• processing said laminate with a gas containing a halogen to remove said peeling layers, whereby said first and second semiconductor integrated circuits are peeled from their respective support substrates.