Micro semiconductor chip transfer method and micro semiconductor chip transfer device

A micro semiconductor chip transfer method comprising:

• preparing a transfer substrate comprising an upper portion having grooves formed therein;
• supplying, to the upper portion of the transfer substrate, a suspension comprising micro semiconductor chips and a liquid;
• and
• aligning the micro semiconductor chips in the grooves by sweeping, with an alignment bar that comprises a hydrophobic wiper, an upper surface of the transfer substrate while the suspension is on the upper surface of the transfer substrate,
• wherein the aligning comprises moving, with the alignment bar, at least one of the micro semiconductor chips from the upper surface of the transfer substrate, outside of the grooves, into at least one of the grooves, and
• wherein the hydrophobic wiper comprises an opening, and a size of the opening is 100 μm or less.

A micro semiconductor chip transfer device comprising:

• a transfer substrate comprising an upper portion having grooves formed therein;
• a transfer head on which the transfer substrate is seated;
• a suspension supply module configured to supply a suspension to the upper portion of the transfer substrate on the transfer head, the suspension comprising at least one micro semiconductor chip and a liquid;
• and
• an align bar that comprises a hydrophobic wiper that is configured to sweep the transfer substrate,
• wherein the align bar is further configured to move, by sweeping the transfer substrate, the at least one micro semiconductor chip from an upper surface of the transfer substrate, outside of the grooves, into at least one of the grooves, and
• wherein the transfer substrate comprises a surface energy reduction pattern, and the surface energy reduction pattern comprises a plurality of convex patterns in an area between the grooves on the upper surface of the transfer substrate.