Semiconductor mounting apparatus and semiconductor mounting method
AssigneeKioxia Corporation
InventorTaishi NAKAHARA
Life of this patent
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Abstract
According to one embodiment, a semiconductor mounting apparatus includes an electronic component holder, a substrate holder, and a mounting head. On the electronic component holder, two or more semiconductor chips having first surfaces provided with an adhesive agent are placeable. The substrate holder holds a substrate on which the two or more semiconductor chips are to be mounted. The mounting head picks up the two or more semiconductor chips from the electronic component holder, and mounts the two or more semiconductor chips on the substrate in such a manner that the first surfaces face the substrate.
Claims16
A semiconductor mounting apparatus comprising:
- an electronic component holder on which two or more semiconductor chips having first surfaces provided with an adhesive agent are placeable;
- a substrate holder that holds a substrate on which the two or more semiconductor chips are to be mounted;
- and
- a mounting head that picks up the two or more semiconductor chips from the substrate holder, and mounts the picked-up two or more semiconductor chips on the substrate in such a manner that the first surfaces face the substrate.
A semiconductor mounting method comprising:
- placing, on an electronic component holder, two or more semiconductor chips having first surfaces provided with an adhesive agent;
- picking up the two or more semiconductor chips from the electronic component holder, and transferring the two or more semiconductor chips to a substrate holder that holds a substrate on which the two or more semiconductor chips are to be mounted;
- and
- placing the two or more semiconductor chips on the substrate in such a manner that the first surfaces face the substrate.
Dependencies are inferred from the claim text.