Using a temporary substrate to attach components to a display substrate when fabricating a passive type display device

A method of manufacturing a passive type display device, the method comprising the steps of:

• forming an amorphous semiconductor film over a temporary substrate;
• introducing a material capable of crystallizing the amorphous semiconductor film;
• crystallizing the amorphous semiconductor film by thermally annealing to form a crystalline semiconductor film;
• forming a driver circuit using the crystalline semiconductor film;
• and
• attaching the driver circuit formed over the temporary substrate onto a display substrate of the passive type display device.

A method of manufacturing a passive type display device, the method comprising the steps of:

• forming a peeling layer comprising silicon on a glass substrate;
• forming an underlying film on the peeling layer;
• forming a semiconductor integrated circuit on the underlying film;
• forming a passivation film on the semiconductor integrated circuit;
• sticking a transfer substrate to the passivation film;
• etching the peeling layer with a halogen fluoride thereby separating said semiconductor integrated circuit from the glass substrate;
• and
• after separating the semiconductor integrated circuit, attaching the semiconductor integrated circuit to a display substrate with said underlying film therebetween.