H10P 70/277
The processing being a planarisation of conductive layers
Official title: {the processing being a planarisation of conductive layers}
H10P70/277 (The processing being a planarisation of conductive layers) appears on 721 US grants and 937 published applications in this corpus.
Search patents in H10P- Granted patents
- 721
- Published applications
- 937
- Assignees
- 188
- Inventors
- 1,705
- Latest grant
- 6 Oct 2026
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| 1996 | 0 | 0 |
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| 2002 | 38 | 48 |
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| 2004 | 47 | 53 |
| 2005 | 35 | 61 |
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| 2024 | 24 | 26 |
| 2025 | 23 | 29 |
| 2026 | 18 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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