Back to results
US 2026/0209554 A1Published application
Planarization solution for abrasive-free copper planarization
OwnerSudhanshu Misra, Suryadevara Babu +4inventors
InventorsSudhanshu Misra, Suryadevara Babu, Nikunjkumar R. Visaveliya, Matthias Stender, Changxue Wang, Mykola Abramchuk
Life of this patent
Estimating the term…
Abstract
Examples are disclosed that relate to a planarization solution for abrasive-free planarization. The planarization solution comprises a hydrolyzing agent, a first chelator, and a second chelator.
Claims20
A planarization solution for abrasive-free planarization, the planarization solution comprising:
- a hydrolyzing agent;
- a first chelator;
- and
- a second chelator.
1 more element
A method of planarizing a substrate comprising copper, the method comprising:
- removing copper from the substrate by contacting the substrate with a chemically functionalized planarization pad and a planarization solution, the planarization solution comprising a hydrolyzing agent, a first chelator, and a second chelator.
A chemical planarization system, comprising:
- a chemically functionalized planarization pad;
- a platen configured to support the chemically functionalized planarization pad;
- a substrate holder configured to hold a substrate against a surface of the chemically functionalized planarization pad;
- and
- a planarization solution introduction system comprising a planarization solution, the planarization solution introduction system configured to introduce the planarization solution onto the chemically functionalized planarization pad, the planarization solution comprising a hydrolyzing agent, a first chelator, and a second chelator.
2 more elements
Dependencies are inferred from the claim text.