H10P 14/687
The materials being fluorocarbon compounds
Official title: {the materials being fluorocarbon compounds, e.g. (CHxFy) n or polytetrafluoroethylene}
H10P14/687 (The materials being fluorocarbon compounds) appears on 437 US grants and 393 published applications in this corpus.
Search patents in H10P- Granted patents
- 437
- Published applications
- 393
- Assignees
- 182
- Inventors
- 991
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 6 | 0 |
| 1998 | 8 | 0 |
| 1999 | 14 | 0 |
| 2000 | 30 | 0 |
| 2001 | 28 | 8 |
| 2002 | 28 | 20 |
| 2003 | 30 | 29 |
| 2004 | 20 | 21 |
| 2005 | 14 | 30 |
| 2006 | 18 | 22 |
| 2007 | 14 | 16 |
| 2008 | 13 | 13 |
| 2009 | 7 | 10 |
| 2010 | 9 | 18 |
| 2011 | 5 | 9 |
| 2012 | 9 | 4 |
| 2013 | 6 | 10 |
| 2014 | 9 | 10 |
| 2015 | 6 | 12 |
| 2016 | 12 | 17 |
| 2017 | 21 | 30 |
| 2018 | 13 | 13 |
| 2019 | 19 | 8 |
| 2020 | 11 | 22 |
| 2021 | 11 | 14 |
| 2022 | 14 | 17 |
| 2023 | 13 | 16 |
| 2024 | 13 | 9 |
| 2025 | 10 | 11 |
| 2026 | 6 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method for detecting analytes9 Jun 2026US 12,650,407 B2Monash University
- Method for etching a layer through a patterned mask layer9 Jun 2026US 12,652,979 B2Tokyo Electron Limited
- Selective deposition using differential surface charging14 Apr 2026US 12,603,249 B2Tokyo Electron Limited
- Methods and structures for improving etch profile of underlying layers7 Apr 2026US 12,598,932 B2Tokyo Electron Limited
- Resist underlayer film-forming composition13 Aug 2026US 2026/0235957 A1Nissan Chemical Corporation
- Resist underlayer film-forming composition for reducing environmental load6 Aug 2026US 2026/0227700 A1Nissan Chemical Corporation
- Dc bias in plasma process30 Apr 2026US 2026/0120995 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing metal fluoride-containing organic polymer film, patterning method, and method for manufacturing semiconductor device8 Jan 2026US 2026/0011545 A1Kioxia Corporation
- Low leakage device2 Oct 2025US 2025/0311412 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- UV exposure for improving properties and adhesion of dielectric polymer films formed by chemical vapor deposition574US 6,284,050 B1Novellus Systems, Inc. · 2001
- Chamber seasoning method to improve adhesion of F-containing dielectric film to metal for VLSI application556US 6,624,064 B1APPLIED Materials.Inc. · 2003
- Semiconductor junction formation process including low temperature plasma deposition of an optical absorption layer and high speed optical annealing543US 7,109,098 B1APPLIED Materials.Inc. · 2006
- Method of cyclic dry etching using etchant film475US 9,793,135 B1ASM IP Holding B. V. · 2017
- Technique to deposit sidewall passivation for high aspect ratio cylinder etch440US 9,997,373 B2Lam Research Corporation · 2018