H10P 14/68
Organic materials
Official title: Organic materials, e.g. photoresists
H10P14/68 (Organic materials) appears on 2,493 US grants and 2,515 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,493
- Published applications
- 2,515
- Assignees
- 640
- Inventors
- 5,368
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 11 | 0 |
| 1978 | 11 | 0 |
| 1979 | 6 | 0 |
| 1980 | 5 | 0 |
| 1981 | 4 | 0 |
| 1982 | 11 | 0 |
| 1983 | 12 | 0 |
| 1984 | 10 | 0 |
| 1985 | 12 | 0 |
| 1986 | 19 | 0 |
| 1987 | 15 | 0 |
| 1988 | 18 | 0 |
| 1989 | 6 | 0 |
| 1990 | 12 | 0 |
| 1991 | 16 | 0 |
| 1992 | 23 | 0 |
| 1993 | 18 | 0 |
| 1994 | 9 | 0 |
| 1995 | 6 | 0 |
| 1996 | 7 | 0 |
| 1997 | 11 | 0 |
| 1998 | 20 | 0 |
| 1999 | 37 | 0 |
| 2000 | 60 | 0 |
| 2001 | 78 | 26 |
| 2002 | 69 | 76 |
| 2003 | 79 | 88 |
| 2004 | 66 | 101 |
| 2005 | 58 | 99 |
| 2006 | 69 | 104 |
| 2007 | 59 | 53 |
| 2008 | 51 | 59 |
| 2009 | 48 | 60 |
| 2010 | 44 | 63 |
| 2011 | 35 | 49 |
| 2012 | 51 | 54 |
| 2013 | 53 | 56 |
| 2014 | 64 | 96 |
| 2015 | 88 | 167 |
| 2016 | 138 | 164 |
| 2017 | 165 | 156 |
| 2018 | 115 | 149 |
| 2019 | 147 | 158 |
| 2020 | 157 | 168 |
| 2021 | 105 | 112 |
| 2022 | 96 | 100 |
| 2023 | 92 | 131 |
| 2024 | 78 | 72 |
| 2025 | 81 | 101 |
| 2026 | 46 | 53 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- High selectivity, low stress, and low hydrogen carbon hardmasks in low-pressure conditions with wide gap electrode spacing15 Sep 2026US 12,735,785 B2Lam Research Corporation
- Semiconductor device and method8 Sep 2026US 12,733,526 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Selectivity of boron hard masks using ion implant25 Aug 2026US 12,721,071 B2APPLIED Materials.Inc.
- Thin film transistor and method of manufactruting thin film transistor18 Aug 2026US 12,713,660 B2Toppan Inc.
- In situ acyclic diamino carbene (ADC) deposition18 Aug 2026US 12,713,849 B2APPLIED Materials.Inc.
- Transistor isolation structures8 Oct 2026US 2026/0314046 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Image sensing device and methods of manufacturing the same8 Oct 2026US 2026/0314089 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Base film agent and processing method for workpiece8 Oct 2026US 2026/0314287 A1Disco Corporation
- Semiconductor device and method8 Oct 2026US 2026/0314458 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Polymer and composition comprising the same1 Oct 2026US 2026/0297377 A1Merck Patent GmbH
Most cited
By later US patents
- Method for manufacturing porous structure and method for forming pattern645US 6,565,763 B1Kabushiki Kaisha Toshiba · 2003
- Method for low temperature chemical vapor deposition of low-k films using selected cyclosiloxane and ozone gases for semiconductor applications600US 7,084,079 B2International Business Machines Corporation · 2006
- UV exposure for improving properties and adhesion of dielectric polymer films formed by chemical vapor deposition574US 6,284,050 B1Novellus Systems, Inc. · 2001
- Chamber seasoning method to improve adhesion of F-containing dielectric film to metal for VLSI application556US 6,624,064 B1APPLIED Materials.Inc. · 2003
- Method for forming a thin film using an atomic layer deposition (ALD) process543US 6,815,350 B2Samsung Electronics Co., Ltd. · 2004