H10P 14/683
Carbon-based polymeric organic materials
Official title: {carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC}
H10P14/683 (Carbon-based polymeric organic materials) appears on 1,985 US grants and 1,994 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,985
- Published applications
- 1,994
- Assignees
- 548
- Inventors
- 4,392
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 9 | 0 |
| 1978 | 10 | 0 |
| 1979 | 5 | 0 |
| 1980 | 5 | 0 |
| 1981 | 1 | 0 |
| 1982 | 8 | 0 |
| 1983 | 10 | 0 |
| 1984 | 8 | 0 |
| 1985 | 10 | 0 |
| 1986 | 15 | 0 |
| 1987 | 12 | 0 |
| 1988 | 15 | 0 |
| 1989 | 5 | 0 |
| 1990 | 9 | 0 |
| 1991 | 15 | 0 |
| 1992 | 19 | 0 |
| 1993 | 10 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 7 | 0 |
| 1997 | 10 | 0 |
| 1998 | 18 | 0 |
| 1999 | 32 | 0 |
| 2000 | 52 | 0 |
| 2001 | 73 | 24 |
| 2002 | 65 | 66 |
| 2003 | 70 | 80 |
| 2004 | 58 | 86 |
| 2005 | 53 | 92 |
| 2006 | 62 | 95 |
| 2007 | 51 | 49 |
| 2008 | 48 | 53 |
| 2009 | 43 | 50 |
| 2010 | 39 | 48 |
| 2011 | 30 | 41 |
| 2012 | 37 | 37 |
| 2013 | 38 | 31 |
| 2014 | 46 | 62 |
| 2015 | 59 | 121 |
| 2016 | 82 | 109 |
| 2017 | 117 | 121 |
| 2018 | 90 | 111 |
| 2019 | 107 | 122 |
| 2020 | 119 | 144 |
| 2021 | 85 | 95 |
| 2022 | 80 | 73 |
| 2023 | 75 | 100 |
| 2024 | 61 | 59 |
| 2025 | 63 | 81 |
| 2026 | 38 | 44 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- High selectivity, low stress, and low hydrogen carbon hardmasks in low-pressure conditions with wide gap electrode spacing15 Sep 2026US 12,735,785 B2Lam Research Corporation
- Semiconductor device and method8 Sep 2026US 12,733,526 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Thin film transistor and method of manufactruting thin film transistor18 Aug 2026US 12,713,660 B2Toppan Inc.
- In situ acyclic diamino carbene (ADC) deposition18 Aug 2026US 12,713,849 B2APPLIED Materials.Inc.
- Direct-bonded optoelectronic devices11 Aug 2026US 12,708,053 B2Adeia Semiconductor Technologies LLC
- Transistor isolation structures8 Oct 2026US 2026/0314046 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Image sensing device and methods of manufacturing the same8 Oct 2026US 2026/0314089 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Base film agent and processing method for workpiece8 Oct 2026US 2026/0314287 A1Disco Corporation
- Semiconductor device and method8 Oct 2026US 2026/0314458 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Polymer and composition comprising the same1 Oct 2026US 2026/0297377 A1Merck Patent GmbH
Most cited
By later US patents
- Method for manufacturing porous structure and method for forming pattern645US 6,565,763 B1Kabushiki Kaisha Toshiba · 2003
- UV exposure for improving properties and adhesion of dielectric polymer films formed by chemical vapor deposition574US 6,284,050 B1Novellus Systems, Inc. · 2001
- Chamber seasoning method to improve adhesion of F-containing dielectric film to metal for VLSI application556US 6,624,064 B1APPLIED Materials.Inc. · 2003
- Semiconductor junction formation process including low temperature plasma deposition of an optical absorption layer and high speed optical annealing543US 7,109,098 B1APPLIED Materials.Inc. · 2006
- Plasma curing process for porous low-k materials529US 6,913,796 B2Axcelis Technologies, Inc. · 2005