Direct-bonded optoelectronic devices

A bonded apparatus, comprising:

• a first element comprising an optoelectronic device, a first substrate, and a first bonding surface including a first electrical contact and a first dielectric;
• a second element comprising an active region and a second bonding surface including a second electrical contact and a second dielectric, wherein the first element is directly bonded to the second element to form a dielectric-to-dielectric direct bond between the first dielectric and the second dielectric and a metal-to-metal direct bond between the first electrical contact and the second electrical contact;
• an encapsulant disposed along at least a side portion of the second element;
• and
• a waveguide to transmit an optical signal from the optoelectronic device.

A bonded apparatus, comprising:

• an optoelectronic element comprising a first electrical contact and a first dielectric;
• a reconstituted element comprising an electronic element and a fill material disposed along at least a side portion of the electronic element;
• and
• a transparent substrate disposed over and coupled to the optoelectronic element and the reconstituted element,
• wherein the electronic element comprises an active semiconductor portion, the active semiconductor portion including a second electrical contact and a second dielectric, wherein the first electrical contact is directly bonded to the second electrical contact, and wherein the first dielectric is directly bonded to the second dielectric.