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US 2026/0227700 A1Published application
Resist underlayer film-forming composition for reducing environmental load
AssigneeNissan Chemical Corporation
InventorsSatoshi KAMIBAYASHI, Takahiro KISHIOKA
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Abstract
A resist underlayer film-forming composition containing a first component and a solvent, in which the first component has an aromatic ring, at least one oxygen atom directly bonded to the aromatic ring by a single bond, and at least one hydroxy group other than a phenolic hydroxy group, and the solvent contains water in an amount of 50 mass % or more based on the solvent.
Claims19
A resist underlayer film-forming composition containing
- a first component and a solvent, wherein
- the first component has an aromatic ring, at least one oxygen atom directly bonded to the aromatic ring by a single bond, and at least one hydroxy group other than a phenolic hydroxy group, and
- the solvent contains water in an amount of 50 mass % or more based on the solvent.
A resist underlayer film-forming composition containing
- a first component, a second component, and a solvent, wherein
- the first component has an aromatic ring and at least one oxygen atom directly bonded to the aromatic ring by a single bond,
- the second component is a water-soluble polymer,
- a mass ratio between the first component and the second component (first component:second component) is 99:1 to 50:50, and
- the solvent contains water in an amount of 50 mass % or more based on the solvent.
2 more elements
Dependencies are inferred from the claim text.