H10P 14/3406
Carbon
Official title: {Carbon, e.g. diamond-like carbon}
H10P14/3406 (Carbon) appears on 767 US grants and 954 published applications in this corpus.
Search patents in H10P- Granted patents
- 767
- Published applications
- 954
- Assignees
- 394
- Inventors
- 1,712
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 6 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 0 |
| 2002 | 2 | 2 |
| 2003 | 1 | 4 |
| 2004 | 0 | 3 |
| 2005 | 4 | 9 |
| 2006 | 5 | 16 |
| 2007 | 6 | 10 |
| 2008 | 5 | 13 |
| 2009 | 10 | 16 |
| 2010 | 10 | 45 |
| 2011 | 23 | 33 |
| 2012 | 24 | 46 |
| 2013 | 42 | 58 |
| 2014 | 46 | 72 |
| 2015 | 64 | 82 |
| 2016 | 69 | 63 |
| 2017 | 57 | 75 |
| 2018 | 56 | 66 |
| 2019 | 65 | 58 |
| 2020 | 53 | 55 |
| 2021 | 33 | 40 |
| 2022 | 41 | 52 |
| 2023 | 29 | 46 |
| 2024 | 35 | 40 |
| 2025 | 30 | 33 |
| 2026 | 22 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Integrated circuit structure and method for forming the same25 Aug 2026US 12,720,834 B2National Taiwan University
- Substrate processing method and substrate processing apparatus25 Aug 2026US 12,721,058 B2Tokyo Electron Limited
- Graphene optical sensor4 Aug 2026US 12,701,763 B2Fujitsu Limited
- Devices having and methods of forming thermally conductive substrates4 Aug 2026US 12,702,001 B2Akash Systems, Inc.
- Atomic layer deposition of passivation layer28 Jul 2026US 12,696,695 B2Tokyo Electron Limited
- Semiconductor device and method for forming the same8 Oct 2026US 2026/0314000 A1National Taiwan University
- Integrated circuit structure and method for forming the same8 Oct 2026US 2026/0314001 A1National Taiwan University
- Substrate processing method and method of manufacturing semiconductor device using the same24 Sep 2026US 2026/0293542 A1Samsung Electronics Co., Ltd.
- Devices and methods involving low-temperature-grown diamond in electronic devices27 Aug 2026US 2026/0250881 A1The Board of Trustees of the Leland Stanford Junior University
- Microwave plasma cvd device27 Aug 2026US 2026/0253840 A1National Institute of Advanced Industrial Science and Technology
Most cited
By later US patents
- Flowable carbon for semiconductor processing477US 9,514,932 B2APPLIED Materials.Inc. · 2016
- Semiconductor thin film forming method, production methods for semiconductor device and electrooptical device, devices used for these methods, and semiconductor device and electrooptical device465US 7,183,229 B2Sony Corporation · 2007
- Printable, flexible and stretchable diamond for thermal management281US 8,470,701 B2Advanced Diamond Technologies, Inc. · 2013
- Single crystal semiconductor substrate articles and semiconductor devices comprising same65US 5,006,914 AAdvanced Technology Materials, Inc. · 1991
- Diamond growth method54US 5,006,203 ATexas Instruments Incorporated · 1991