H10B 12/0387
Making the trench
Official title: {Making the trench}
H10B12/0387 (Making the trench) appears on 721 US grants and 721 published applications in this corpus.
Search patents in H10B- Granted patents
- 721
- Published applications
- 721
- Assignees
- 107
- Inventors
- 1,047
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 16 | 0 |
| 2001 | 37 | 17 |
| 2002 | 36 | 30 |
| 2003 | 47 | 54 |
| 2004 | 57 | 64 |
| 2005 | 55 | 87 |
| 2006 | 54 | 62 |
| 2007 | 32 | 42 |
| 2008 | 45 | 42 |
| 2009 | 23 | 24 |
| 2010 | 25 | 16 |
| 2011 | 21 | 11 |
| 2012 | 17 | 19 |
| 2013 | 16 | 24 |
| 2014 | 27 | 17 |
| 2015 | 17 | 23 |
| 2016 | 29 | 22 |
| 2017 | 26 | 16 |
| 2018 | 16 | 12 |
| 2019 | 15 | 12 |
| 2020 | 14 | 20 |
| 2021 | 21 | 16 |
| 2022 | 13 | 14 |
| 2023 | 11 | 33 |
| 2024 | 11 | 14 |
| 2025 | 26 | 15 |
| 2026 | 7 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Assembly structure including a plurality of spacers and method of manufacturing the same6 Oct 2026US 12,757,375 B2Nanya Technology Corporation
- Memory device and fabrication method thereof8 Sep 2026US 12,733,154 B2Nanya Technology Corporation
- Semiconductor device and method of manufacturing the same7 Jul 2026US 12,677,409 B2Kioxia Corporation
- eDRAM and method for making same31 Mar 2026US 12,593,435 B2Hangzhou HFC Semiconductor Co.
- Stress absorbing trench capacitor and method for forming the same17 Mar 2026US 12,581,636 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Memory Circuitry And Methods Used In Forming Memory Circuitry1 Oct 2026US 2026/0304756 A1Micron Technology, Inc.
- Assembly structure including a plurality of spacers and method of manufacturing the same17 Sep 2026US 2026/0282318 A1Nanya Technology Corporation
- Semiconductor device including a memory array and methods of formation23 Jul 2026US 2026/0214885 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device including insulating element and method of making16 Jul 2026US 2026/0206211 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device with capacitor25 Jun 2026US 2026/0181859 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Technique to deposit sidewall passivation for high aspect ratio cylinder etch440US 9,997,373 B2Lam Research Corporation · 2018
- Semiconductor device and method of manufacturing the same372US 6,737,716 B1Kabushiki Kaisha Toshiba · 2004
- Optical disc, recording apparatus, and computer-readable recording medium338US 6,078,727 AMatsushita Electric Industrial Co., Ltd. · 2000
- Tantalum nitride CVD deposition by tantalum oxide densification285US 6,638,810 B2APPLIED Materials.Inc. · 2003
- Patterned SOI regions in semiconductor chips183US 6,333,532 B1International Business Machines Corporation · 2001