H05K 2203/06
Lamination
H05K2203/06 (Lamination) appears on 1,531 US grants and 1,448 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,531
- Published applications
- 1,448
- Assignees
- 627
- Inventors
- 3,249
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 11 | 0 |
| 1977 | 4 | 0 |
| 1978 | 4 | 0 |
| 1979 | 4 | 0 |
| 1980 | 7 | 0 |
| 1981 | 8 | 0 |
| 1982 | 10 | 0 |
| 1983 | 6 | 0 |
| 1984 | 1 | 0 |
| 1985 | 14 | 0 |
| 1986 | 11 | 0 |
| 1987 | 24 | 0 |
| 1988 | 19 | 0 |
| 1989 | 28 | 0 |
| 1990 | 26 | 0 |
| 1991 | 14 | 0 |
| 1992 | 20 | 0 |
| 1993 | 17 | 0 |
| 1994 | 22 | 0 |
| 1995 | 18 | 0 |
| 1996 | 25 | 0 |
| 1997 | 23 | 0 |
| 1998 | 21 | 0 |
| 1999 | 23 | 0 |
| 2000 | 21 | 0 |
| 2001 | 24 | 22 |
| 2002 | 36 | 44 |
| 2003 | 39 | 59 |
| 2004 | 45 | 64 |
| 2005 | 41 | 70 |
| 2006 | 40 | 71 |
| 2007 | 66 | 71 |
| 2008 | 38 | 83 |
| 2009 | 39 | 97 |
| 2010 | 49 | 88 |
| 2011 | 60 | 57 |
| 2012 | 63 | 60 |
| 2013 | 62 | 40 |
| 2014 | 44 | 53 |
| 2015 | 34 | 84 |
| 2016 | 59 | 57 |
| 2017 | 65 | 38 |
| 2018 | 35 | 36 |
| 2019 | 61 | 56 |
| 2020 | 36 | 35 |
| 2021 | 43 | 59 |
| 2022 | 48 | 56 |
| 2023 | 30 | 50 |
| 2024 | 44 | 46 |
| 2025 | 30 | 34 |
| 2026 | 19 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2203/063Of preperforated insulating layerIndexing code590
- H05K 2203/061Of previously made multilayered subassembliesIndexing code364
- H05K 2203/068Features of the lamination press or of the lamination processIndexing code297
- H05K 2203/066Transfer laminating of insulating materialIndexing code189
- H05K 2203/065Binding insulating layers without adhesiveIndexing code113
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Connection structure for yarn wire and circuit board15 Sep 2026US 12,739,980 B2Makalot Industrial Co., Ltd.
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Transparent article with electrically-conductive pattern1 Sep 2026US 12,727,092 B2Eastman Kodak Company
- Crosstalk noise reduction by high permeability insulator2 Jun 2026US 12,648,458 B2International Business Machines Corporation
- Transparent article with electrically-conductive pattern8 Oct 2026US 2026/0313810 A1Eastman Kodak Company
- Component Carrier With Electronic Component and Thick Thermally Conductive Layers on Both Sides1 Oct 2026US 2026/0304632 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Resin film, metal-clad laminate, printed wiring board, and method for producing resin film13 Aug 2026US 2026/0233497 A1The University of Osaka
- Circuit board assembly with embedded electronic devices and method for manufacturing the same6 Aug 2026US 2026/0231338 A1Avary Holding (Shenzhen) Co., Limited.
- Deposition apparatus, method for depositing, method for packaging a die in a chip package30 Jul 2026US 2026/0218369 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
Most cited
By later US patents
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Method of fabricating compliant interface for semiconductor chip367US 5,659,952 ATessera, Inc. · 1997
- Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom286US 6,036,099 A2000
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993