H05K 2203/066
Transfer laminating of insulating material
Official title: Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
H05K2203/066 (Transfer laminating of insulating material) appears on 189 US grants and 138 published applications in this corpus.
Search patents in H05K- Granted patents
- 189
- Published applications
- 138
- Assignees
- 111
- Inventors
- 479
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 6 | 0 |
| 1986 | 2 | 0 |
| 1987 | 10 | 0 |
| 1988 | 5 | 0 |
| 1989 | 7 | 0 |
| 1990 | 6 | 0 |
| 1991 | 2 | 0 |
| 1992 | 8 | 0 |
| 1993 | 7 | 0 |
| 1994 | 5 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 7 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 9 |
| 2002 | 12 | 10 |
| 2003 | 6 | 14 |
| 2004 | 10 | 9 |
| 2005 | 9 | 10 |
| 2006 | 5 | 9 |
| 2007 | 10 | 11 |
| 2008 | 0 | 4 |
| 2009 | 6 | 11 |
| 2010 | 2 | 8 |
| 2011 | 2 | 4 |
| 2012 | 5 | 5 |
| 2013 | 6 | 1 |
| 2014 | 2 | 1 |
| 2015 | 1 | 5 |
| 2016 | 3 | 3 |
| 2017 | 2 | 3 |
| 2018 | 2 | 3 |
| 2019 | 3 | 2 |
| 2020 | 2 | 3 |
| 2021 | 2 | 2 |
| 2022 | 1 | 0 |
| 2023 | 1 | 0 |
| 2024 | 4 | 5 |
| 2025 | 1 | 2 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Flexible laminated board and multilayer circuit board14 May 2024US 11,985,762 B2Ube Exsymo Co., Ltd.
- Deposition apparatus, method for depositing, method for packaging a die in a chip package30 Jul 2026US 2026/0218369 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Circuit board manufacturing device and circuit board manufacturing method30 Jul 2026US 2026/0223294 A1NHK Spring Co., Ltd.
- Method for producing printed wiring board, photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor package2 Jul 2026US 2026/0190248 A1Resonac Corporation
- Ultra-thin copper foil with carrier foil and method for manufacturing embedded substrate by using same29 Jan 2026US 2026/0032815 A1Lotte Energy Materials Corporation
- Metal-clad laminate, printed wiring board, semiconductor package, and method for manufacturing same17 Jul 2025US 2025/0234458 A1Resonac Corporation
Most cited
By later US patents
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Fabrication of discrete thin film wiring structures158US 5,224,265 AInternational Business Machines Corporation · 1993
- Solder ball array and method of preparation135US 5,637,832 APacific Microelectronics Corporation · 1997
- Electrically and thermally conductive adhesive transfer tape128US 4,606,962 AMinnesota Mining and Manufacturing Company · 1986
- Solder ball array97US 5,504,277 APacific Microelectronics Corporation · 1996