Methods of forming flexible interconnect circuits

A method of forming an interconnect circuit, the method comprising:

• laminating a substrate to a conductive layer, wherein:
• the conductive layer comprises a first side and a second side, opposite of the first side, and
• the substrate is laminated to the second side of the conductive layer;
• patterning the conductive layer using one or more of laser cutting and laser ablation while the conductive layer remains laminated to the substrate, wherein:
• patterning the conductive layer forms a first conductive portion and a second conductive portion of the conductive layer, at least partially separated from the first conductive portion, and
• the substrate maintains orientation of the first conductive portion relative to the second conductive portion during and after patterning;
• laminating a first insulator to the first side of the conductive layer while the conductive layer remains laminated to the substrate, wherein the first insulator comprises an insulator adhesive, contacting the first side of the conductive layer and comprising one of a polyolefin adhesive, a polyester adhesive, a polyimide adhesive, an acrylic, an epoxy, a cross-linking adhesive, a pressure-sensitive adhesive, and a thermoplastic adhesive;
• removing the substrate from the conductive layer, wherein the first insulator maintains the orientation of the first conductive portion relative to the second conductive portion while and after the substrate is removed;
• and
• laminating a second insulator to the second side of the conductive layer while the first insulator remains laminated to the conductive layer , wherein:
• the first insulator comprises a first-insulator opening prior to laminating the first insulator to the first side of the conductive layer,
• the second insulator comprises a second-insulator opening prior to laminating the second insulator to the second side of the conductive layer, and
• the first-insulator opening and the second-insulator opening coincide with each other and are aligned relative to the first conductive portion of the conductive layer thereby allowing access to the first conductive portion of the conductive layer from each of the first side and the second side.

A method of forming a flexible interconnect circuit, the method comprising:

• laminating a substrate to a conductive layer, wherein:
• the conductive layer comprises a first side and a second side, opposite of the first side, and
• the substrate is laminated to the second side of the conductive layer;
• patterning the conductive layer using one or more of laser cutting and laser ablation while the conductive layer remains laminated to the substrate, wherein:
• patterning the conductive layer forms a first conductive portion and a second conductive portion of the conductive layer, at least partially separated from the first conductive portion, and
• patterning the conductive layer at least partially damages the substrate such that the substrate maintains orientation of the first conductive portion relative to the second conductive portion during and after patterning;
• laminating a first insulator to the first side of the conductive layer while the conductive layer remains laminated to the substrate;
• removing the substrate from the conductive layer, wherein the first insulator maintains the orientation of the first conductive portion relative to the second conductive portion while and after the substrate is removed;
• and
• laminating a second insulator to the second side of the conductive layer while the first insulator remains laminated to the conductive layer, wherein:
• the first insulator comprises a first-insulator opening prior to laminating the first insulator to the first side of the conductive layer,
• the second insulator comprises a second-insulator opening prior to laminating the second insulator to the second side of the conductive layer, and
• the first-insulator opening and the second-insulator opening coincide with each other and are aligned relative to the first conductive portion of the conductive layer thereby allowing access to the first conductive portion of the conductive layer from each of the first side and the second side.