H05K 2203/065
Binding insulating layers without adhesive
Official title: Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
H05K2203/065 (Binding insulating layers without adhesive) appears on 113 US grants and 122 published applications in this corpus.
Search patents in H05K- Granted patents
- 113
- Published applications
- 122
- Assignees
- 83
- Inventors
- 276
- Latest grant
- 30 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 3 |
| 2002 | 5 | 11 |
| 2003 | 12 | 12 |
| 2004 | 9 | 12 |
| 2005 | 8 | 10 |
| 2006 | 5 | 5 |
| 2007 | 8 | 5 |
| 2008 | 4 | 4 |
| 2009 | 0 | 5 |
| 2010 | 5 | 7 |
| 2011 | 3 | 3 |
| 2012 | 7 | 4 |
| 2013 | 2 | 1 |
| 2014 | 1 | 4 |
| 2015 | 0 | 0 |
| 2016 | 1 | 2 |
| 2017 | 3 | 4 |
| 2018 | 0 | 4 |
| 2019 | 5 | 2 |
| 2020 | 2 | 4 |
| 2021 | 5 | 6 |
| 2022 | 5 | 6 |
| 2023 | 2 | 0 |
| 2024 | 3 | 4 |
| 2025 | 1 | 2 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing printed wiring board30 Dec 2025US 12,513,828 B2Ibiden Co., Ltd.
- Resin multilayer substrate and method for manufacturing resin multilayer substrate15 Oct 2024US 12,120,817 B2Murata Manufacturing Co., Ltd.
- Method for joining flexible foils comprising LEDs11 Jun 2024US 12,007,082 B2Signify Holding B. V.
- Method for manufacturing printed wiring board12 Mar 2024US 11,930,601 B2Ibiden Co., Ltd.
- Resin substrate and method for manufacturing resin substrate23 May 2023US 11,659,652 B2Murata Manufacturing Co., Ltd.
- Component Carrier With Electronic Component and Thick Thermally Conductive Layers on Both Sides1 Oct 2026US 2026/0304632 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Resin film, metal-clad laminate, printed wiring board, and method for producing resin film13 Aug 2026US 2026/0233497 A1The University of Osaka
- Method for manufacturing printed wiring board and laminating system used for implementing the method23 Oct 2025US 2025/0331109 A1Ibiden Co., Ltd.
- Method for manufacturing circuit board20 Feb 2025US 2025/0063671 A1Lx Semicon Co., Ltd.
- Resin sheet and resin multilayer substrate20 Jun 2024US 2024/0206060 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article124US 6,729,025 B2Foster-Miller, Inc. · 2004
- Electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board66US 6,717,065 B2J. S. T. Mfg. Co., Ltd. · 2004
- Circuit board/printed circuit board having pre-reserved conductive heating circuits64US 6,541,736 B1Usun Technology Co., Ltd. · 2003
- Connecting structure of circuit board and method for manufacturing the same53US 7,229,293 B2Matsushita Electric Industrial Co., Ltd. · 2007
- Method for joining wiring boards and manufacturing data carrier and device for mounting electronic component modules49US 6,523,734 B1OMRON Corporation · 2003