Method for joining wiring boards and manufacturing data carrier and device for mounting electronic component modules
AssigneeOMRON Corporation
InventorsWakahiro Kawai, Masanobu Okada
Life of this patent
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Abstract
A method for joining a first wiring board covered with a conductive pattern on a surface of a thin resin basic plate to a second wiring board covered with a conductive pattern on a thin resin basic plate to ensure the electric connection therebetween, including the steps of putting said first and second wiring boards together in a confront relationship so as to adjust join predetermined portions on the conductive patterns, catching the join predetermined portions in the status by a pair of ultrasonic welding tools, and applying an ultrasonic vibration to said ultrasonic welding tools to weld the conductive metals located on the join predetermined portions.
Claims3
A method for joining wiring boards, the method comprising:
- providing first and second non-conductive wiring boards, both wiring boards being made up of a resin material, and both wiring boards being respectively covered with a conductive pattern;
- placing said first and second non-conductive wiring boards together in a face-to-face relationship such that a first predetermined portion of said conductive pattern covering said first wiring board is facing a second predetermined portion of said conductive pattern covering said second wiring board;
- positioning the first and second predetermined portions between first and second welding surfaces of an ultrasonic welding tool;
- applying an ultrasonic vibration to said first and second welding surfaces to weld the first and second predetermined portions of said respective conductive patterns, thereby creating a conductive bond therebetween;
- exposing at least a portion of at least one of said first and second non-conductive wiring boards as a result of said act of applying an ultrasonic vibration;
- and
- welding at least a portion of said first non-conductive wiring board to said second non-conductive wiring board, thereby creating a mechanical bond between said wiring boards in addition to said conductive bond.
A method for manufacturing a data carrier, the method comprising:
- providing an electronic component module being made up of a resin material and having a conductive pattern and at least one electronic component on at least one of its surfaces;
- providing a data carrier body being made up of a resin material and having a spiral conductive pattern on its surface;
- placing said electronic component module and said data carrier body together in a face-to-face relationship such that a first predetermined conductive portion of said electronic component module is facing a second predetermined conductive portion of said data carrier body;
- positioning the first and second predetermined portions between first and second welding surfaces of an ultrasonic welding tool;
- and
- applying an ultrasonic vibration to said first and second welding surfaces to weld the first and second predetermined portions, thereby creating a conductive bond therebetween.
Dependencies are inferred from the claim text.