H05K 2203/063
Of preperforated insulating layer
Official title: of preperforated insulating layer
H05K2203/063 (Of preperforated insulating layer) appears on 590 US grants and 539 published applications in this corpus.
Search patents in H05K- Granted patents
- 590
- Published applications
- 539
- Assignees
- 277
- Inventors
- 1,170
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 10 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 7 | 0 |
| 1992 | 4 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 11 | 0 |
| 1996 | 14 | 0 |
| 1997 | 15 | 0 |
| 1998 | 11 | 0 |
| 1999 | 12 | 0 |
| 2000 | 11 | 0 |
| 2001 | 13 | 6 |
| 2002 | 11 | 10 |
| 2003 | 14 | 14 |
| 2004 | 10 | 17 |
| 2005 | 12 | 23 |
| 2006 | 11 | 26 |
| 2007 | 22 | 27 |
| 2008 | 18 | 44 |
| 2009 | 22 | 56 |
| 2010 | 20 | 52 |
| 2011 | 33 | 32 |
| 2012 | 38 | 32 |
| 2013 | 42 | 18 |
| 2014 | 29 | 31 |
| 2015 | 18 | 36 |
| 2016 | 28 | 19 |
| 2017 | 27 | 10 |
| 2018 | 16 | 13 |
| 2019 | 17 | 16 |
| 2020 | 15 | 6 |
| 2021 | 13 | 24 |
| 2022 | 10 | 7 |
| 2023 | 11 | 7 |
| 2024 | 7 | 8 |
| 2025 | 4 | 2 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Carrier assembly and method for producing a carrier assembly21 Apr 2026US 12,610,474 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Electrical circuit board assemblies27 Jan 2026US 12,538,428 B2Simmonds Precision Products, Inc.
- Wiring substrate and method for manufacturing wiring substrate13 Jan 2026US 12,526,918 B2Niterra Co., Ltd.
- Roll-to-roll additive manufacturing method and device12 Aug 2025US 12,389,551 B2
- Sidewall plating of circuit boards for layer transition connections5 Aug 2025US 12,382,581 B2International Business Machines Corporation
- Circuit board assembly with embedded electronic devices and method for manufacturing the same6 Aug 2026US 2026/0231338 A1Avary Holding (Shenzhen) Co., Limited.
- Roll-To-Roll Additive Manufacturing Method and Device11 Jun 2026US 2026/0164564 A1Trackonomy Systems, Inc.
- Electronic device and manufacturing method thereof26 Feb 2026US 2026/0059664 A1Innolux Corporation
- Coverlay as printed circuit board (pcb) voltage insulator under connectors10 Jul 2025US 2025/0227854 A1Hamilton Sundstrand Corporation
- Electrical circuit forming method and electrical circuit forming apparatus3 Apr 2025US 2025/0113447 A1Fuji Corporation
Most cited
By later US patents
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Method of fabricating compliant interface for semiconductor chip367US 5,659,952 ATessera, Inc. · 1997
- Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces260US 7,225,537 B2CardXX, Inc. · 2007
- Method for producing multilayer printed wiring boards247US 5,258,094 ANEC Corporation · 1993
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997