Electrical circuit forming method and electrical circuit forming apparatus
AssigneeFuji Corporation
InventorsTasuku TAKEUCHI, Ryo SAKAKIBARA
Life of this patent
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Abstract
An electrical circuit forming method including a wiring forming step of forming a metal wiring on a first resin layer, a resin layer forming step of forming a second resin layer having a hole through which a part of the metal wiring is exposed on the first resin layer using an ultraviolet curable resin, and a coating body forming step of forming a coating body covering the metal wiring exposed at an inside of the hole using a thermosetting resin or a conductive fluid, in which in the resin layer forming step, the second resin layer is formed such that a wall surface defining the hole protrudes toward the inside of the hole as the wall surface goes downward.
Claims5
An electrical circuit forming method comprising:
- a wiring forming step of forming a metal wiring on a first resin layer;
- a resin layer forming step of forming a second resin layer having a hole through which a part of the metal wiring is exposed on the first resin layer using an ultraviolet curable resin;
- and
- a coating body forming step of forming a coating body covering the metal wiring exposed at an inside of the hole using a thermosetting resin or a conductive fluid,
- wherein, in the resin layer forming step, the second resin layer is formed such that a wall surface defining the hole protrudes toward the inside of the hole as the wall surface goes downward.
An electrical circuit forming apparatus comprising:
- a wiring forming device configured to form a metal wiring on a first resin layer;
- a resin layer forming device configured to form a second resin layer having a hole through which a part of the metal wiring is exposed on the first resin layer using an ultraviolet curable resin;
- and
- a coating body forming device configured to form a coating body covering the metal wiring exposed at an inside of the hole using a thermosetting resin or a conductive fluid,
- wherein the resin layer forming device forms the second resin layer such that a wall surface defining the hole protrudes toward the inside of the hole as the wall surface goes downward.
Dependencies are inferred from the claim text.