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AssigneeSimmonds Precision Products, Inc.
InventorsJeffrey Ewanchuk, Paul Martin Franz, Christopher Fitzhugh, Scott R. Durkee
Estimating the term…
A circuit board assembly can include a circuit component die, a first dielectric layer disposed on a first side of the circuit component die made of a first dielectric material having a high thermal conductivity, a second dielectric layer disposed on a second side of the circuit component die made of the first dielectric material, and a bulk dielectric material having a lower thermal conductivity than the first dielectric material. The bulk dielectric material can have a lower glass transition temperature than the first dielectric material and being heterogeneous to the first dielectric material. The bulk dielectric material can be in flowed contact with lateral sides of the circuit component die, the first dielectric layer, and the second dielectric layer to laterally enclose the circuit component die, the first dielectric layer, and the second dielectric layer.
A circuit board assembly, comprising:
A method for embedding a circuit component die within a circuit board assembly, comprising:
Dependencies are inferred from the claim text.