H05K 2203/068
Features of the lamination press or of the lamination process
Official title: Features of the lamination press or of the lamination process, e.g. using special separator sheets
H05K2203/068 (Features of the lamination press or of the lamination process) appears on 297 US grants and 215 published applications in this corpus.
Search patents in H05K- Granted patents
- 297
- Published applications
- 215
- Assignees
- 190
- Inventors
- 711
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 8 | 0 |
| 1983 | 6 | 0 |
| 1984 | 0 | 0 |
| 1985 | 6 | 0 |
| 1986 | 7 | 0 |
| 1987 | 11 | 0 |
| 1988 | 5 | 0 |
| 1989 | 14 | 0 |
| 1990 | 12 | 0 |
| 1991 | 8 | 0 |
| 1992 | 8 | 0 |
| 1993 | 5 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 6 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 2 | 1 |
| 2002 | 4 | 3 |
| 2003 | 2 | 3 |
| 2004 | 4 | 7 |
| 2005 | 1 | 8 |
| 2006 | 5 | 15 |
| 2007 | 8 | 10 |
| 2008 | 7 | 11 |
| 2009 | 7 | 11 |
| 2010 | 7 | 8 |
| 2011 | 11 | 5 |
| 2012 | 4 | 7 |
| 2013 | 3 | 3 |
| 2014 | 3 | 7 |
| 2015 | 3 | 6 |
| 2016 | 4 | 9 |
| 2017 | 7 | 3 |
| 2018 | 3 | 9 |
| 2019 | 14 | 22 |
| 2020 | 9 | 7 |
| 2021 | 7 | 8 |
| 2022 | 10 | 15 |
| 2023 | 5 | 14 |
| 2024 | 10 | 13 |
| 2025 | 7 | 8 |
| 2026 | 6 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Crosstalk noise reduction by high permeability insulator2 Jun 2026US 12,648,458 B2International Business Machines Corporation
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- Wiring board and method for manufacturing wiring board24 Mar 2026US 12,588,139 B2Fujikura Ltd.
- High-Density Multi-Level Interconnects for Harsh Environments and Power Packaging and Method of Making The Same12 Feb 2026US 2026/0047003 A1
- Method for producing metal foil-clad laminate, resin composition, resin composite sheet, method for producing printed wiring board, and method for producing semiconductor device12 Feb 2026US 2026/0047004 A1Mitsubishi Gas Chemical Company, Inc.
- Copper/ceramic bonded body and insulated circuit board27 Nov 2025US 2025/0365859 A1Mitsubishi Materials Corporation
- Method for manufacturing multilayer substrate27 Nov 2025US 2025/0365869 A1Fict Limited
- Method for manufacturing printed wiring board and laminating system used for implementing the method23 Oct 2025US 2025/0331109 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom286US 6,036,099 A2000
- Method for fabricating multilayer circuits128US 4,806,188 AE. I. Du Pont de Nemours and Company · 1989
- Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards112US 6,214,155 B12001
- Lamination method for coating the sidewall or filling a cavity in a substrate107US 5,208,068 AInternational Business Machines Corporation · 1993
- Semiconductor package104US 5,014,159 AOlin Corporation · 1991