Method for producing multi-layer circuit boards

A method for to produce multi-layer circuit boards, the method comprising:

• arranging, within an assembly method step, at least two functional layers and at least one insulation layer of a circuit board to be produced in a layered manner between a tool lower part and a tool upper part of a multi-part tool;
• positioning at least one measurement value sensor between the tool upper part and the tool lower part such that the measurement value sensor lies against at least one of the at least two functional layers and/or the at least one insulation layer of the circuit board to be produced;
• inserting, in an equipping step, the multi-part tool with the at least two functional layers and the at least one insulation layer and the at least one measurement value sensor into a thermo-compression chamber;
• pressing, in a production step, the tool upper part and the tool lower part against each other in the thermo-compression chamber, with the at least two functional layers, provided therebetween and the at least one insulation layer and the measurement value sensor provided between the tool upper part and the tool lower part, the tool upper part and the tool lower part being pressed together while being heated via at least a first heating plate, wherein the tool lower part is positioned on top of the first heating plate;
• detecting measurement values by the measurement value sensor;
• transferring the measurement values and/or data obtained therefrom to a production control device during the production step;
• and
• processing the measurement values and/or the data obtained therefrom by the production control device during the production step to monitor the production step and/or to control the production step in relation to a set value for a measurement variable of the measurement value sensor.