H05K 2203/061
Of previously made multilayered subassemblies
Official title: of previously made multilayered subassemblies
H05K2203/061 (Of previously made multilayered subassemblies) appears on 364 US grants and 435 published applications in this corpus.
Search patents in H05K- Granted patents
- 364
- Published applications
- 435
- Assignees
- 174
- Inventors
- 908
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 6 | 0 |
| 1990 | 4 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 5 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 4 | 3 |
| 2002 | 5 | 11 |
| 2003 | 6 | 21 |
| 2004 | 13 | 23 |
| 2005 | 12 | 25 |
| 2006 | 17 | 21 |
| 2007 | 23 | 21 |
| 2008 | 12 | 27 |
| 2009 | 8 | 22 |
| 2010 | 17 | 21 |
| 2011 | 14 | 19 |
| 2012 | 14 | 17 |
| 2013 | 20 | 16 |
| 2014 | 9 | 14 |
| 2015 | 14 | 14 |
| 2016 | 15 | 17 |
| 2017 | 18 | 8 |
| 2018 | 10 | 6 |
| 2019 | 12 | 12 |
| 2020 | 6 | 13 |
| 2021 | 17 | 17 |
| 2022 | 15 | 26 |
| 2023 | 10 | 24 |
| 2024 | 19 | 16 |
| 2025 | 17 | 16 |
| 2026 | 4 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems and methods for improving high frequency transmission in printed circuit boards10 Mar 2026US 12,575,022 B2
- Type-3 printed circuit boards (PCBS) with hybrid layer counts17 Feb 2026US 12,557,216 B2Intel Corporation
- Electronic package structure and manufacturing method thereof17 Feb 2026US 12,557,711 B2Unimicron Technology Corp.
- Method for manufacturing circuit board6 Jan 2026US 12,520,423 B2Fict Limited
- Component carrier interconnection and manufacturing method9 Dec 2025US 12,495,498 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Systems and methods for improving high frequency transmission in printed circuit boards18 Jun 2026US 2026/0173251 A1
- Flexible Printed Circuit and Electronic Device18 Jun 2026US 2026/0173258 A1Honor Device Co., Ltd.
- Printed circuit board11 Jun 2026US 2026/0164554 A1Samsung Electro-Mechanics Co., Ltd.
- Circuit board and method of manufacturing circuit board7 May 2026US 2026/0129754 A1Sumitomo Electric Industries, Ltd.
- Package substrate and fabricating method thereof26 Feb 2026US 2026/0059658 A1AaltoSemi Inc.
Most cited
By later US patents
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993
- Wiring substrate133US 9,818,681 B2Shinko Electric Industries Co., Ltd. · 2017
- Flip chip type semiconductor device and method for manufacturing the same132US 6,406,942 B2NEC Corporation · 2002
- Laminated electronic package including a power/ground assembly117US 5,574,630 AInternational Business Machines Corporation · 1996