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US 12,575,022 B2Granted
Systems and methods for improving high frequency transmission in printed circuit boards
OwnerRohi Halimi, Itsik Refaeli +1inventors
InventorsRohi Halimi, Itsik Refaeli, Miroslav Baryakh
Life of this patent
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Abstract
Systems and methods for improving high frequency transmission in printed circuit boards use the smooth internal interfaces between the conducting laminate and dielectric substrates of PCB cores to serve as signal carrying lines and ground planes in transmission lines. Flanking PCB cores may be mounted to a central dielectric layer including a stripped PCB core providing structural integrity of the PCB.
Claims8
A method for manufacturing a printed circuit board (PCB) comprising:
- providing a first PCB core comprising a central core comprising a rigid base material void of conductor lamination;
- adhering an upper inner prepreg layer to an upper side surface of the central core and a lower inner prepreg layer to a lower surface of the central core;
- providing an upper flanking PCB core and a lower flanking PCB core;
- adhering the upper flanking PCB core to the upper inner prepreg layer and the lower flanking PCB core to the lower inner prepreg layer;
- adhering an upper outer prepreg layer to the upper flanking PCB core and a lower outer prepreg layer to the lower flanking PCB core;
- adhering an upper outer conducting layer to the upper outer prepreg layer and a lower outer conducting layer to the lower outer prepreg layer;
- and
- applying a solder mask,
- wherein the step of providing the central core void of conductor lamination comprises:
- providing a first PCB core comprising a conductor laminated rigid base material, and
- removing all conducting laminate from the first PCB core leaving only a substrate of rigid base dielectric material.
8 more elements
A method for manufacturing a printed circuit board (PCB), comprising:
- providing a first PCB core comprising a central core comprising a rigid base material void of conductor lamination;
- adhering an upper inner prepreg layer to an upper side surface of the central core and a lower inner prepreg layer to a lower surface of the central core;
- providing an upper flanking PCB core and a lower flanking PCB core;
- adhering the upper flanking PCB core to the upper inner prepreg layer and the lower flanking PCB core to the lower inner prepreg layer;
- adhering an upper outer prepreg layer to the upper flanking PCB core and a lower outer prepreg layer to the lower flanking PCB core;
- adhering an upper outer conducting layer to the upper outer prepreg layer and a lower outer conducting layer to the lower outer prepreg layer;
- and
- applying a solder mask,
- wherein each outer conducting layer comprises an outer PCB core layer, and the step of adhering each outer conducting layer to an outer prepreg layer comprises:
- providing the outer PCB core layer comprising a rigid base material laminated by an outer conducting surface and an inner conducting surface,
- removing all conducting material from the inner conducting surface of the outer PCB core thereby creating an inner dielectric surface,
- abutting the inner dielectric surface to the outer prepreg layer, and
- pressing the outer PCB core layer to the outer prepreg layer.
10 more elements
Dependencies are inferred from the claim text.