Component carrier interconnection and manufacturing method

A method of manufacturing a component carrier assembly, the method comprising:

• providing a first component carrier with at least one first electrically insulating layer structure;
• forming a first cavity in the at least one first electrically insulating layer structure;
• at least partially filling the first cavity with electrically conductive material to obtain a via;
• forming an upper part of the via comprising at least a part of the electrically conductive material that extends beyond an outer main surface of the first component carrier;
• providing a second component carrier with at least one electrically conductive layer structure with at least one pad and at least one second electrically insulating layer structure at the bottom of the at least one pad, wherein the at least one pad is partly covered by the second electrically insulating layer structure;
• forming a second cavity in the at least second electrically insulating layer structure;
• filling the second cavity at least partially with electrically conductive adhesive material;
• interconnecting by stacking the first component carrier and the second component carrier, thereby penetrating the upper part of the via at least partially in the electrically conductive adhesive material,
• wherein the electrically conductive adhesive material only surrounds the upper part of the via of the first component carrier and only partially surrounds the sidewalls of the upper part of the via,
• wherein the electrically conductive adhesive material only contacts a central portion of the at least one pad.