H05K 2203/02
Details related to mechanical or acoustic processing
Official title: Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
H05K2203/02 (Details related to mechanical or acoustic processing) appears on 2,501 US grants and 2,416 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,501
- Published applications
- 2,416
- Assignees
- 1,127
- Inventors
- 5,778
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 6 | 0 |
| 1978 | 11 | 0 |
| 1979 | 3 | 0 |
| 1980 | 5 | 0 |
| 1981 | 9 | 0 |
| 1982 | 10 | 0 |
| 1983 | 9 | 0 |
| 1984 | 9 | 0 |
| 1985 | 16 | 0 |
| 1986 | 13 | 0 |
| 1987 | 26 | 0 |
| 1988 | 30 | 0 |
| 1989 | 28 | 0 |
| 1990 | 32 | 0 |
| 1991 | 27 | 0 |
| 1992 | 36 | 0 |
| 1993 | 26 | 0 |
| 1994 | 28 | 0 |
| 1995 | 32 | 0 |
| 1996 | 37 | 0 |
| 1997 | 43 | 0 |
| 1998 | 47 | 0 |
| 1999 | 58 | 0 |
| 2000 | 66 | 0 |
| 2001 | 67 | 40 |
| 2002 | 71 | 81 |
| 2003 | 75 | 82 |
| 2004 | 77 | 103 |
| 2005 | 59 | 91 |
| 2006 | 53 | 105 |
| 2007 | 69 | 99 |
| 2008 | 47 | 119 |
| 2009 | 54 | 159 |
| 2010 | 81 | 131 |
| 2011 | 93 | 88 |
| 2012 | 104 | 79 |
| 2013 | 73 | 80 |
| 2014 | 59 | 80 |
| 2015 | 61 | 126 |
| 2016 | 64 | 94 |
| 2017 | 81 | 102 |
| 2018 | 96 | 116 |
| 2019 | 117 | 90 |
| 2020 | 99 | 109 |
| 2021 | 96 | 115 |
| 2022 | 80 | 72 |
| 2023 | 67 | 78 |
| 2024 | 64 | 72 |
| 2025 | 44 | 62 |
| 2026 | 36 | 43 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2203/0278Flat pressureIndexing code724
- H05K 2203/025AbradingIndexing code487
- H05K 2203/0228Cutting, sawing, milling or shearingIndexing code421
- H05K 2203/0285Using ultrasoundIndexing code263
- H05K 2203/0264Peeling insulating layerIndexing code191
- H05K 2203/0207Partly drilling through substrate until a controlled depthIndexing code174
- H05K 2203/0271Mechanical force other than pressureIndexing code116
- H05K 2203/0292Using vibrationIndexing code86
All 13 subgroupsShow fewer
Recent patents
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- Printed circuit board and method of manufacturing the same22 Sep 2026US 12,745,342 B2Rolls-Royce Deutschland Ltd & Co KG
- Membrane circuit board1 Sep 2026US 12,727,079 B2Chicony Electronics Co., Ltd.
- Semiconductor package warpage and alignment management17 Sep 2026US 2026/0282241 A1Arm Limited
- Power electronics assembly3 Sep 2026US 2026/0261213 A1
- Circuit board and manufacturing method thereof27 Aug 2026US 2026/0255475 A1Avary Holding (Shenzhen) Co., Limited.
- Element transfer device and method for controlling the same27 Aug 2026US 2026/0255499 A1Chungang University Industry Academic Cooperation Foundation
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
Most cited
By later US patents
- Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom286US 6,036,099 A2000
- Stretchable and foldable electronic devices220US 8,552,299 B2The Board of Trustees of the University of Illinois · 2013
- Method for making printed circuit boards with selectivity filled plated through holes200US 5,487,218 AInternational Business Machines Corporation · 1996
- Process for producing electrical connections through a substrate191US 4,964,212 ACommissariat A L' Energie Atomique · 1990
- Methods of forming channels and vias in insulating layers187US 5,173,442 AMicroelectronics and Computer Technology Corporation · 1992