H05K 2203/0285
Using ultrasound
Official title: Using ultrasound, e.g. for cleaning, soldering or wet treatment
H05K2203/0285 (Using ultrasound) appears on 263 US grants and 241 published applications in this corpus.
Search patents in H05K- Granted patents
- 263
- Published applications
- 241
- Assignees
- 173
- Inventors
- 656
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 7 | 0 |
| 1995 | 4 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 4 | 0 |
| 1999 | 5 | 0 |
| 2000 | 9 | 0 |
| 2001 | 5 | 3 |
| 2002 | 8 | 9 |
| 2003 | 8 | 8 |
| 2004 | 7 | 10 |
| 2005 | 7 | 7 |
| 2006 | 5 | 13 |
| 2007 | 9 | 12 |
| 2008 | 6 | 17 |
| 2009 | 4 | 17 |
| 2010 | 11 | 14 |
| 2011 | 12 | 8 |
| 2012 | 12 | 4 |
| 2013 | 4 | 5 |
| 2014 | 4 | 9 |
| 2015 | 5 | 11 |
| 2016 | 7 | 12 |
| 2017 | 8 | 10 |
| 2018 | 14 | 15 |
| 2019 | 12 | 8 |
| 2020 | 9 | 12 |
| 2021 | 9 | 14 |
| 2022 | 4 | 3 |
| 2023 | 12 | 4 |
| 2024 | 6 | 8 |
| 2025 | 4 | 5 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Printed wiring board and method for manufacturing printed wiring board25 Nov 2025US 12,484,155 B2KYOCERA Corporation
- Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pins5 Aug 2025US 12,377,489 B2Kulicke and Soffa Industries, Inc.
- Metal substrate structure for a semiconductor power module4 Feb 2025US 12,218,192 B2Hitachi Energy Ltd
- Bonding device14 Jan 2025US 12,199,055 B2Samsung Display Co., Ltd.
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
- Hybrid-material leads for solderless coupling of an electronic component28 May 2026US 2026/0150713 A1Semiconductor Components Industries, LLC
- Manufacturing method for a circuit board and circuit board2 Apr 2026US 2026/0096019 A1JCET Management Co., Ltd.
- Method for preparing micro-nano flexible conductive circuit based on ultrasonic driving of liquid metal4 Dec 2025US 2025/0374438 A1Harbin Inst. of Tech (Shenzhen) (Inst. of Science and Tech Innovation, Harbin Inst. of Tech)
- Component Carrier, Method and Apparatus for Manufacturing the Component Carrier13 Nov 2025US 2025/0351268 A1AT&S (Chongqing) Company Limited
Most cited
By later US patents
- Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier158US 6,406,990 B1OMRON Corporation · 2002
- Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier146US 6,664,645 B2OMRON Corporation · 2003
- Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article124US 6,729,025 B2Foster-Miller, Inc. · 2004
- Selective coating apparatus63US 5,669,971 ASpecialty Coating Systems, Inc. · 1997
- Closed-loop dual-cycle printed circuit board cleaning apparatus and method55US 5,201,958 AElectronic Controls Design, Inc. · 1993