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US 2026/0096019 A1Published application
Manufacturing method for a circuit board and circuit board
AssigneeJCET Management Co., Ltd.
InventorsFeifei WANG, Jun XU, Jingjing SHAN, Shijian ZHAI
Life of this patent
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Abstract
A manufacturing method for the circuit board includes the following steps: printing a board body on a carrier board using a 3D printing device, the board body having a hollow line channel in it, the line channel having openings located on an upper surface or/and a side surface of the board body; injecting a conductive material in a liquid state into the line channel inside the board body through at least one opening; the conductive material being in a solid state after cooling.
Claims20
A manufacturing method for a circuit board, comprising:
- printing a board body on a carrier board using a 3D printing device, the board body having a hollow line channel therein, at least one of an upper surface or a side surface of the board body having an opening connected with the line channel;
- and
- injecting a conductive material in a liquid state into the line channel inside the board body through at least one opening;
- and
- cooling and solidifying the conductive material.
2 more elements
A circuit board, comprising:
- a board body having a hollow line channel therein, at least one of an upper surface or a side surface of the board body having an opening connected with the line channel;
- and
- a conductive material in the line channel inside the board body.
Dependencies are inferred from the claim text.