Metal substrate structure for a semiconductor power module
AssigneeHitachi Energy Ltd
InventorsDavid Guillon, Harald Beyer, Roman Ehrbar
Life of this patent
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Abstract
A method can be used for manufacturing a metal substrate structure for a semiconductor power module. A plurality of terminals are welded to a metal top layer. After the welding, a dielectric layer is coupled between the metal top layer and a metal bottom layer. The dielectric can be laminated or molded, as examples.
Claims21
A method for manufacturing a metal substrate structure for a semiconductor power module, the method comprising:
- welding a plurality of terminals to a metal top layer;
- and
- after the welding, coupling a dielectric layer between the metal top layer and a metal bottom layer.
A method for manufacturing a metal substrate structure for a semiconductor power module, the method comprising:
- welding a plurality of terminals to a metal top layer;
- and
- after the welding, coupling a dielectric layer between the metal top layer and a metal bottom layer, wherein coupling the dielectric layer between the metal top layer and the metal bottom layer comprises:
- providing a molding substance;
- aligning the metal top layer and the metal bottom layer relative to each other with a predetermined distance in between;
- and
- bringing the molding substance between the aligned metal top layer and the metal bottom layer and thereby forming the dielectric layer by molding.
A method for manufacturing a metal substrate structure for a semiconductor power module, the method comprising:
- welding a plurality of terminals to a metal top layer;
- forming a plurality of pad regions within the metal top layer;
- after the welding, aligning the metal top layer with a metal bottom layer;
- and
- molding a dielectric material between the aligned metal top layer and metal bottom layer.
A method for manufacturing a metal substrate structure for a semiconductor power module, the method comprising:
- welding a plurality of terminals to a metal top layer;
- and
- after the welding, aligning the metal top layer with a dielectric layer and a metal bottom layer;
- laminating the metal top layer, the dielectric layer and the metal bottom layer;
- and
- etching portions of the metal top layer to form electrically isolated pads, each terminal being welded to a respective one of the pads.
Dependencies are inferred from the claim text.