H05K 2203/0278
Flat pressure
Official title: Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
H05K2203/0278 (Flat pressure) appears on 724 US grants and 668 published applications in this corpus.
Search patents in H05K- Granted patents
- 724
- Published applications
- 668
- Assignees
- 382
- Inventors
- 1,664
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 5 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 10 | 0 |
| 1988 | 9 | 0 |
| 1989 | 11 | 0 |
| 1990 | 8 | 0 |
| 1991 | 8 | 0 |
| 1992 | 13 | 0 |
| 1993 | 8 | 0 |
| 1994 | 8 | 0 |
| 1995 | 9 | 0 |
| 1996 | 14 | 0 |
| 1997 | 6 | 0 |
| 1998 | 17 | 0 |
| 1999 | 20 | 0 |
| 2000 | 28 | 0 |
| 2001 | 22 | 24 |
| 2002 | 29 | 28 |
| 2003 | 29 | 25 |
| 2004 | 21 | 32 |
| 2005 | 17 | 24 |
| 2006 | 17 | 35 |
| 2007 | 20 | 28 |
| 2008 | 12 | 45 |
| 2009 | 13 | 45 |
| 2010 | 32 | 43 |
| 2011 | 41 | 23 |
| 2012 | 24 | 18 |
| 2013 | 18 | 14 |
| 2014 | 13 | 22 |
| 2015 | 14 | 30 |
| 2016 | 14 | 23 |
| 2017 | 17 | 27 |
| 2018 | 25 | 30 |
| 2019 | 35 | 23 |
| 2020 | 23 | 31 |
| 2021 | 28 | 33 |
| 2022 | 24 | 16 |
| 2023 | 17 | 20 |
| 2024 | 13 | 14 |
| 2025 | 7 | 8 |
| 2026 | 11 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Tape processing method6 Oct 2026US 12,757,333 B2Chipbond Technology Corporation
- Membrane circuit board1 Sep 2026US 12,727,079 B2Chicony Electronics Co., Ltd.
- Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor18 Aug 2026US 12,709,083 B2Resonac Corporation
- Self-equalizing frame for thermal management device preload16 Jun 2026US 12,660,143 B2Cisco Technology, Inc.
- Method for manufacturing joined body, joined body, and hot-melt adhesive sheet5 May 2026US 12,617,976 B2Dexerials Corporation
- Semiconductor package warpage and alignment management17 Sep 2026US 2026/0282241 A1Arm Limited
- Cold-bar soldering systems and methods14 May 2026US 2026/0136453 A1Lutron Technology Company LLC
- Joined body production method, joined body, and hot-melt adhesive sheet23 Apr 2026US 2026/0114311 A1Dexerials Corporation
- Flexible printed circuit board, display device, electronic device, and method for manufacturing a display device5 Mar 2026US 2026/0068038 A1Samsung Display Co., Ltd.
- Tape and manufacturing method thereof5 Mar 2026US 2026/0068058 A1Chipbond Technology Corporation
Most cited
By later US patents
- Method for making printed circuit boards with selectivity filled plated through holes200US 5,487,218 AInternational Business Machines Corporation · 1996
- Manufacturing circuit board assemblies having filled vias171US 5,822,856 AInternational Business Machines Corporation · 1998
- Direct chip attachment structure and method131US 5,439,162 AMotorola, Inc. · 1995
- Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate122US 5,159,535 AInternational Business Machines Corporation · 1992
- Integrated circuit having a coplanar solder ball contact array115US 5,435,482 ALSI Logic Corporation · 1995