Method for manufacturing joined body, joined body, and hot-melt adhesive sheet
AssigneeDexerials Corporation
InventorsHiroyuki Kumakura, Tomoyuki Abe
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a joined body includes subjecting a first electronic component and a second electronic component to thermocompression bonding with a hot-melt adhesive sheet interposed therebetween. The hot-melt adhesive sheet includes a binder and electroconductive particles. The binder includes a crystalline polyamide resin and a crystalline polyester resin. When a melt viscosity of the hot-melt adhesive sheet is measured under a condition of a heating rate of 5° C./min. the hot-melt adhesive sheet has a ratio of a melt viscosity at 20° C. lower than a thermocompression bonding temperature to a melt viscosity at the thermocompression bonding temperature of 10 or higher.
Claims13
A method for manufacturing a joined body, the method comprising
- subjecting a first electronic component comprising a first conductive portion and a second electronic component comprising a second conductive portion to thermocompression bonding with a hot-melt adhesive sheet interposed therebetween, to connect the first conductive portion and the second conductive portion, the hot-melt adhesive sheet comprising a binder and electroconductive particles, the binder comprising a crystalline polyamide resin and a crystalline polyester resin, wherein
- when a melt viscosity of the hot-melt adhesive sheet is measured under a condition of a heating rate of 5° C./min, the hot-melt adhesive sheet has a ratio of a melt viscosity at 20° C. lower than a thermocompression bonding temperature to a melt viscosity at the thermocompression bonding temperature of 10 or higher.
A joined body comprising:
- a first electronic component comprising a first conductive portion;
- a second electronic component comprising a second conductive portion;
- and
- an adhesive layer connecting the first conductive portion and the second conductive portion, wherein
- the adhesive layer comprises;
- a binder comprising a crystalline polyamide resin and a crystalline polyester resin;
- and
- electroconductive particles, and
- when a melt viscosity is measured under a condition of a heating rate of 5° C./min, the adhesive layer has a ratio of a melt viscosity at 100° C. to a melt viscosity at 120° C. of 10 or higher.
A hot-melt adhesive sheet comprising:
- electroconductive particles;
- and
- a binder comprising a crystalline polyamide resin and a crystalline polyester resin, wherein
- when a melt viscosity is measured under a condition of a heating rate of 5° C./min, the hot-melt adhesive sheet has a ratio of a melt viscosity at 100° C. to a melt viscosity at 120° C. of 10 or higher.
Dependencies are inferred from the claim text.