H05K 2203/0235
Laminating followed by cutting or slicing perpendicular to plane of the laminate
Official title: Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
H05K2203/0235 (Laminating followed by cutting or slicing perpendicular to plane of the laminate) appears on 51 US grants and 44 published applications in this corpus.
Search patents in H05K- Granted patents
- 51
- Published applications
- 44
- Assignees
- 44
- Inventors
- 127
- Latest grant
- 30 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 2 |
| 2003 | 2 | 3 |
| 2004 | 4 | 0 |
| 2005 | 1 | 4 |
| 2006 | 0 | 0 |
| 2007 | 4 | 4 |
| 2008 | 1 | 1 |
| 2009 | 2 | 3 |
| 2010 | 2 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 2 |
| 2014 | 0 | 0 |
| 2015 | 1 | 0 |
| 2016 | 0 | 3 |
| 2017 | 1 | 2 |
| 2018 | 0 | 0 |
| 2019 | 1 | 2 |
| 2020 | 2 | 1 |
| 2021 | 2 | 2 |
| 2022 | 2 | 5 |
| 2023 | 1 | 3 |
| 2024 | 3 | 1 |
| 2025 | 3 | 2 |
| 2026 | 0 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing printed wiring board30 Dec 2025US 12,513,828 B2Ibiden Co., Ltd.
- Manufacturing component carrier with cavity by trimming poorly adhesive structure before removing stack material23 Dec 2025US 12,507,350 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Electromagnetic shields with bonding wires for sub-modules30 Sep 2025US 12,431,457 B2Qorvo US, Inc.
- Flexible circuit board3 Sep 2024US 12,082,352 B2Avary Holding (Shenzhen) Co., Limited.
- Resin multilayer substrate and method for manufacturing resin multilayer substrate16 Jul 2024US 12,036,776 B2Murata Manufacturing Co., Ltd.
- Method for manufacturing integrated power electronics6 Aug 2026US 2026/0231339 A1Toyota Motor Engineering & Manufacturing North America, Inc.
- Composite substrate25 Jun 2026US 2026/0181770 A1Murata Manufacturing Co., Ltd.
- Circuit and Fuse Fabrication Process for Flexible Printed Circuit Board (FPCB)14 May 2026US 2026/0136471 A1Guangzhou Amphenol Sincere Flex Circuits Co., Ltd
- Manufacturing Component Carrier With Cavity by Trimming Poorly Adhesive Structure Before Removing Stack Material9 Apr 2026US 2026/0101448 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method for manufacturing printed wiring board and laminating system used for implementing the method23 Oct 2025US 2025/0331109 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Anisotropic elastomeric interconnecting system70US 4,778,950 ADigital Equipment Corporation · 1988
- Multilayer circuit board and a method for fabricating the same68US 5,478,972 AFujitsu Limited · 1995
- Solder delivery systems59US 4,712,721 ARaychem Corporation · 1987
- Interconnection elements with encased interconnects51US 8,988,895 B2Tessera, Inc. · 2015
- Solder medium for circuit interconnection30US 5,509,815 AAT&T Corp. · 1996