Manufacturing Component Carrier With Cavity by Trimming Poorly Adhesive Structure Before Removing Stack Material
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsMingchuan (Jeffery) JIANG, Artan BAFTIRI, Chunyan (Allen) ZHAO
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Abstract
A method of manufacturing a component carrier includes forming a poorly adhesive structure on at least one layer structure, thereafter removing part of the poorly adhesive structure to thereby define a lateral limit of the poorly adhesive structure, thereafter attaching at least one further layer structure to the at least one layer structure and to the poorly adhesive structure, and forming a cavity by removing material of the at least one further layer structure above the poorly adhesive structure.
Claims16
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- and
- a cavity formed in the stack without a lateral undercut exceeding 5 μm along an entire circumference of a bottom of the cavity.
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- a cavity formed in the stack with a lateral undercut.
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- a cavity formed in the stack without a lateral undercut exceeding 5 μm.
Dependencies are inferred from the claim text.