Solder medium for circuit interconnection

A method of fabricating an electronic device including interconnecting one component of said electronic device to another component of said device, said components having aligned mating contact pads, which comprises

• placing a thin electrically insulating body between the surfaces of said mating pads, said body being formed by embedding a plurality of solder wires longitudinally in an insulating matrix, deforming said insulating matrix so as to elongate said insulating matrix and to reduce the diameter of said plurality of solder wires, and cutting said elongated insulating matrix transverse to its longitudinal axis into slices to obtain said body, the length of said slices being determined by a spacing between said mating pads, and wherein the placement of the body is such that opposite ends of at least some of said plurality of solder wires contact the surfaces of the mating pads, at least two of said wires contacting each pair of said mating pads, and applying heat energy to fuse those ends of the wires to the pads which are being contacted by the wires.

A method of fabricating an electronic device including interconnecting one component of said electronic device to another component of said device, said components having aligned mating contact pads, which comprises

• placing a thin electrically insulating body between the surfaces of said mating pads, said body having a plurality of solder wires embedded in an insulating matrix such that opposite ends of at least some wires contact the surfaces of the mating pads, at least two of said wires contacting each pair of said mating pads, and applying heat energy to fuse those ends of the wires to the pads which are being contacted by the wires, and
• wherein said wires are formed by magnetically aligning solder-coated magnetic particles within a sheet of compliant or dissolvable matrix into a plurality of columns arranged transversely to the major surfaces of the sheet, and fusing the solder of individual particles forming continuously electrically conductive wires extending traversely of the sheet.

A solder medium for interconnecting mating pads of circuit components, which comprises

• a sheet of an insulating matrix material and a plurality of solder-containing wires distributed throughout the matrix transversely to opposite major surfaces of the sheet, wherein said sheet is formed by embedding the plurality of solder-containing wires longitudinally in the insulating matrix, deforming said insulating matrix so as to elongate said insulating matrix and to reduce the diameter of said plurality of solder-containing wires, and cutting said elongated insulating matrix transverse to its longitudinal axis into slices, the length of said slices being determined by a spacing between said mating pads, each of said wires having a high-aspect of length-to-diameter ratio.

A method of preparing a solder medium for use in circuit interconnections wherein contact pads on one component of a circuit are connected to mating pads on another component of the circuit, which comprises forming an elongated body, said elongated body being formed by

• longitudinally embedding a plurality of solder wires in an electrically insulating plastically deformable matrix to form an embedded body,
• deforming the embedded body longitudinally so as to elongate the embedded body and to reduce the diameter of the solder wires, and
• cutting said elongated embedded body transverse to its longitudinal axis into slices the length of said slices being determined by a spacing between said mating contact pads.

A method of preparing a solder medium for use in circuit interconnections wherein contact pads on one component of a circuit are connected to mating pads on another component of the circuit, which comprises forming an elongated body having a plurality of elongated solder wires supported within a matrix of an insulating material, said wires extended longitudinally of the body and being separated each from another by said matrix, and

• cutting said elongated embedded body transverse to its longitudinally axis into slices, the length of said slices being determined by a spacing between said mating contact pads, and wherein
• said elongated body is formed by embedding a plurality of solder particles in a matrix of an electrically insulating material forming a composite structure into an elongated structure in which said particles are deformed into elongated wires or ribbons.