Interconnection elements with encased interconnects

An interconnection element, comprising:

• a plurality of drawn metal conductors each having a structure in which grains therein have lengths oriented in a direction between first and second ends thereof;
• a common metal region comprised of a plurality of annular components, the plurality of annular components having outer circumferences directly bonded to each other and each of the plurality of annular components surrounding an individual one of the plurality of drawn metal conductors, the common metal region being extruded along an entire length of the plurality of drawn metal conductors, the common metal region forming an outer boundary of the interconnection element and configured to carry a common electric potential;
• and
• a dielectric layer separating the individual ones of the conductors from the common metal region, the dielectric having first and second opposed surfaces and a thickness less than 0.5 millimeters between the first and second surfaces, wherein the first and second ends of each conductor are not covered by the dielectric layer at the first and second surfaces;
• wherein the interconnection element has first and second pluralities of wettable contacts adjacent the first and second opposed surfaces, respectively, the first and second wettable contacts being usable to bond the interconnection element to at least one of a microelectronic element and a circuit panel, at least one of the first wettable contacts or the second wettable contacts matching a spatial distribution of element contacts at a face of a microelectronic element or matching a spatial distribution of circuit contacts at a face of a circuit panel.