Electromagnetic shields with bonding wires for sub-modules

A method for forming an electronic module, the method comprising:

• providing a first sub-module and a second sub-module on a mounting surface of a substrate;
• forming a plurality of bonding wires on the substrate between the first sub-module and the second sub-module by bonding opposing ends of each bonding wire of the plurality of bonding wires to different portions of the substrate and forming bonding wire loops between each of the opposing ends;
• embedding the first sub-module, the second sub-module, and the plurality of bonding wires within an overmold body;
• removing a portion of the overmold body to form exposed surfaces of the plurality of bonding wires;
• forming a cavity in the overmold body around an exposed surface of a first bonding wire of the plurality of bonding wires, the cavity having a width that is greater than a width of the first bonding wire of the plurality of bonding wires;
• and
• depositing an electromagnetic shield on the overmold body, the electromagnetic shield being electrically coupled with the exposed surfaces of the plurality of bonding wires.