H05K 2203/0242
Cutting around hole
Official title: Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
H05K2203/0242 (Cutting around hole) appears on 76 US grants and 86 published applications in this corpus.
Search patents in H05K- Granted patents
- 76
- Published applications
- 86
- Assignees
- 61
- Inventors
- 190
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 4 | 1 |
| 2002 | 2 | 3 |
| 2003 | 3 | 4 |
| 2004 | 6 | 3 |
| 2005 | 1 | 6 |
| 2006 | 3 | 4 |
| 2007 | 6 | 6 |
| 2008 | 4 | 9 |
| 2009 | 2 | 6 |
| 2010 | 5 | 2 |
| 2011 | 2 | 3 |
| 2012 | 4 | 7 |
| 2013 | 6 | 5 |
| 2014 | 3 | 3 |
| 2015 | 3 | 3 |
| 2016 | 2 | 0 |
| 2017 | 2 | 1 |
| 2018 | 2 | 3 |
| 2019 | 1 | 2 |
| 2020 | 4 | 2 |
| 2021 | 0 | 3 |
| 2022 | 2 | 3 |
| 2023 | 2 | 4 |
| 2024 | 1 | 1 |
| 2025 | 2 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of forming high aspect ratio plated through holes10 Mar 2026US 12,575,036 B2Sanmina Corporation
- System and method to eliminate via striping13 May 2025US 12,302,496 B2Dell Products L. P.
- Printed circuit board and wire arrangement method thereof14 Jan 2025US 12,200,863 B2Celestica Technology Consultancy (Shanghai) Co. Ltd
- Substrate and electronic device2 Jul 2024US 12,028,968 B2Sony Group Corporation
- Methods and systems for back-drilling a multi-layer circuit board27 Jun 2023US 11,690,177 B2NextGin Technology BV
- Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board9 Jul 2026US 2026/0197948 A1Sanmina Corporation
- Connector structures13 Feb 2025US 2025/0056711 A1Cisco Technology, Inc.
- System and method to eliminate via striping7 Mar 2024US 2024/0080978 A1Dell Products L. P.
- Differential via design on a printed circuit board26 Oct 2023US 2023/0345634 A1Dell Products L. P.
- Shielded signal vias in printed circuit boards for high-frequency and broadband signals14 Sep 2023US 2023/0292431 A1TTM Technologies, Inc.
Most cited
By later US patents
- Backplane for radio frequency signals134US 6,392,160 B1Lucent Technologies Inc. · 2002
- High speed multi-layer printed circuit board via117US 6,541,712 B1Teradyhe, Inc. · 2003
- Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board63US 7,337,537 B1Alcatel Lucent · 2008
- High speed interconnect using printed circuit board with plated bores56US 6,663,442 B1Tyco Electronics Corporation · 2003
- Method for tuning an embedded capacitor in a multilayer circuit board56US 7,220,287 B1Nortel Networks Limited · 2007