Methods and systems for back-drilling a multi-layer circuit board

A method, comprising:

• electrically connecting a boring device having a cutting device with a barrel of an aperture of a plated multi-layered circuit board, the barrel of the aperture comprising an electrically conductive material, the cutting device having a diameter larger than an outer diameter of the barrel;
• extending the cutting device until contact with the barrel of the plated multi-layered circuit board is sensed by sensing a closed circuit between the cutting device and the barrel;
• progressively reciprocating the cutting device a plurality of times, with each reciprocation extending the cutting device a first predetermined distance into the barrel to form a bore and retracting the cutting device a second predetermined distance to a retracted position within the bore, wherein the second predetermined distance is less than the first predetermined distance;
• and
• while in the retracted position, determining a sliver of the barrel remains within the first predetermined distance, by sensing electrical contact indicating a closed circuit between the cutting device and the sliver of the barrel of the plated multi-layered circuit board.