Differential via design on a printed circuit board
AssigneeDell Products L.P.
InventorsChang-Kai Chu, Chang-Hsien Chen, Bhyrav Mutnury
Life of this patent
Estimating the term…
Abstract
An information handling system includes a printed circuit board having a signal via fabricated through the printed circuit board. The signal via includes a conductive metal plating. The signal via also includes first and second via portions. The first via portion is connected to a first trace of a differential pair. The second via portion is connected to a second trace of the differential pair. The first and second via portions are formed in the conductive metal plating.
Claims20
A printed circuit board of an information handling system, the printed circuit board comprising:
- a signal via fabricated through the printed circuit board, wherein the signal via includes a conductive metal plating, the signal via includes;
- a first via portion connected to a first trace of a differential pair;
- and
- a second via portion connected to a second trace of the differential pair, wherein the first and second via portions are formed in the conductive metal plating.
An information handling system comprising:
- a printed circuit board including:
- first and second pads of a differential pair;
- and
- a signal via fabricated through the printed circuit board, wherein the signal via includes a conductive metal plating, the signal via includes;
- a first via portion connected by a first trace to the first pad of the differential pair;
- and
- a second via portion connected by a second trace to the second pad of the differential pair, wherein the first and second via portions are formed in the conductive metal plating.
A method comprising:
- fabricating a signal via in a printed circuit board of an information handling system;
- plating the signal via with a conductive material;
- removing first and second sections of the signal via to create first and second via portions of the signal via;
- routing a first trace from the first portion to a first pad of a differential pair;
- and
- routing a second trace from the second portion to a second pad of the differential pair.
Dependencies are inferred from the claim text.