Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board
AssigneeAlcatel Lucent
InventorJoseph Smetana, Jr.
Life of this patent
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Abstract
A method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board are described herein. In the preferred embodiment, the printed circuit board includes a via extending through a plurality of stacked layers. The via includes a plated through hole and a back-drilled hole. The plated through hole is located within a predetermined number of the stacked layers and the back-drilled hole is located within the remaining stacked layer(s). The plated through hole without an electrically conductive material located on walls therein has a diameter that is substantially the same size or smaller than the diameter of the back-drilled hole.
Claims4
A method for forming a plated through hole in a multi-layered printed circuit board, said method comprising the steps of:
- drilling a first hole having a first diameter through said printed circuit board;
- drilling a second hole having a second diameter concentrically around and through a predetermined depth of said first hole in said printed circuit board;
- plating said second hole and a remaining portion of said first hole in said printed circuit board;
- and
- back-drilling a third hole having a third diameter concentrically around and through the remaining portion of said plated first hole to remove that portion of said plated first hole and leave said plated second hole which forms the plated through hole in said printed circuit board.
Dependencies are inferred from the claim text.