High speed interconnect using printed circuit board with plated bores

An interconnection for use in electronic equipment, the interconnection comprising:

• a circuit board including a via and an electrically conductive trace, the via including a bore extending completely through the circuit board, the bore having a perimeter and a total depth through the circuit board, and an electrically conductive barrel extending around at least a portion of the perimeter of the bore and along a predetermined depth of the bore, the predetermined depth being less than the total depth of the bore, the barrel having an end that terminates at a countersunk portion of the bore in one side of the circuit board, the barrel contacting the trace;
• and
• a contact having a compliant section that is press fitted in the barrel to form an electrical signal path from the contact to the barrel, the electrical signal path being devoid of solder, wherein a separable interface exists between the contact and the circuit board, the compliant section having an end that does not extend out of the barrel toward the one side of the circuit board, wherein no part of the electrical signal path extends into the countersunk portion of the bore.