US 6,541,712 B1 · High speed multi-layer printed circuit board via

Abstract

A multi-layer printed circuit board includes a via having a conductive upper portion, a conductive lower portion, and an electrically insulating intermediate portion between the upper and lower portions. In one embodiment, the insulating intermediate portion of the via is provided by a non-platable layer of the circuit board, as may be comprised of PTFE. Vias having a continuous conductive coating may be formed through clearance holes in the non-platable layer which are provided with a platable inner surface, either by filling the hole with a platable material, such as epoxy resin, prior to laminating the board or by chemically conditioning the non-platable material to make it platable. In a further embodiment, the as insulating intermediate portion of the via has a narrower diameter than the conductive upper and lower portions.

Claims12

Dependent claims

A printed circuit board comprising:

a plurality of stacked dielectric layers;
and
a via extending through said stacked dielectric layers, said via having an upper portion with electrically conductive walls, a lower portion with electrically conductive walls, and an intermediate portion with electrically insulating walls, said intermediate portion disposed between said upper portion and said lower portion.

Dependencies are inferred from the claim text.

Facts

Application

10/007,689Filed 4 Dec 2001

Granted

1 Apr 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

H05K 1/115
Printed elements for providing electric connections to or between printed circuits: via connections; Lands around holes or via connections
H05K 3/429
Plated through-holes or plated via connections: plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit…
H05K 2201/0187
Dielectric layers: with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
H05K 2201/096
Conductive through-holes or vias: vertically aligned vias, holes or stacked vias

High speed multi-layer printed circuit board via

Life of this patent

High speed multi-layer printed circuit board via

Life of this patent

Abstract

Claims12