H05K 2203/0228
Cutting, sawing, milling or shearing
H05K2203/0228 (Cutting, sawing, milling or shearing) appears on 421 US grants and 446 published applications in this corpus.
Search patents in H05K- Granted patents
- 421
- Published applications
- 446
- Assignees
- 297
- Inventors
- 1,046
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 6 | 0 |
| 2000 | 9 | 0 |
| 2001 | 9 | 3 |
| 2002 | 11 | 12 |
| 2003 | 10 | 10 |
| 2004 | 9 | 14 |
| 2005 | 9 | 9 |
| 2006 | 9 | 18 |
| 2007 | 9 | 16 |
| 2008 | 12 | 12 |
| 2009 | 4 | 12 |
| 2010 | 7 | 12 |
| 2011 | 6 | 18 |
| 2012 | 15 | 14 |
| 2013 | 7 | 19 |
| 2014 | 9 | 13 |
| 2015 | 16 | 22 |
| 2016 | 11 | 19 |
| 2017 | 26 | 28 |
| 2018 | 27 | 31 |
| 2019 | 31 | 21 |
| 2020 | 26 | 18 |
| 2021 | 21 | 31 |
| 2022 | 21 | 19 |
| 2023 | 18 | 17 |
| 2024 | 14 | 19 |
| 2025 | 9 | 23 |
| 2026 | 13 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Tape processing method6 Oct 2026US 12,757,333 B2Chipbond Technology Corporation
- Printed circuit board and method of manufacturing the same22 Sep 2026US 12,745,342 B2Rolls-Royce Deutschland Ltd & Co KG
- Method for producing wiring board25 Aug 2026US 12,721,211 B2Mitsui Kinzoku Company, Limited
- Light-emitting image sensing module and method for fabricating the same11 Aug 2026US 12,707,568 B2Medimaging Integrated Solution, Inc.
- Wiring substrate, method of trimming same, and multi-layered wiring board4 Aug 2026US 12,701,662 B2Mitsui Kinzoku Company, Limited
- Power electronics assembly3 Sep 2026US 2026/0261213 A1
- Circuit board and manufacturing method thereof27 Aug 2026US 2026/0255475 A1Avary Holding (Shenzhen) Co., Limited.
- Method for manufacturing integrated power electronics6 Aug 2026US 2026/0231339 A1Toyota Motor Engineering & Manufacturing North America, Inc.
- Wiring board30 Jul 2026US 2026/0223287 A1Shinko Electric Industries Co., Ltd.
- Method for manufacturing wiring substrate, and wiring substrate2 Jul 2026US 2026/0190243 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom286US 6,036,099 A2000
- LED luminaire117US 8,272,762 B2Lighting Science Group Corporation · 2012
- Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards112US 6,214,155 B12001
- Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards97US 5,817,207 A1998
- Methods of forming integrated circuit packages85US 6,277,671 B1Micron Technology, Inc. · 2001