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US 2026/0223287 A1Published application
Wiring board
AssigneeShinko Electric Industries Co., Ltd.
InventorKeigo SATO
Life of this patent
Estimating the term…
Abstract
A wiring board includes a stack, a recess that opens at an upper surface and a side surface of the stack, a metal layer having an upper surface exposed at a bottom of the recess, and an insulating layer having an upper surface exposed at the bottom of the recess. A side surface of the metal layer is covered with the insulating layer.
Claims9
A wiring board comprising:
- a stack;
- a recess that opens at an upper surface and a side surface of the stack;
- a metal layer having an upper surface exposed at a bottom of the recess;
- and
- an insulating layer having an upper surface exposed at the bottom of the recess,
- wherein a side surface of the metal layer is covered with the insulating layer.
3 more elements
Dependencies are inferred from the claim text.